Lithium-ion battery negative electrode current collector material and preparation method
A lithium-ion battery and current collector technology, applied in battery electrodes, electrode carriers/current collectors, secondary batteries, etc., can solve the safety hazards of lithium-ion batteries, such as explosions and fires, and improve the chemical properties that are easily oxidized, Effects of improving safety performance and improving corrosion resistance
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Embodiment approach 1
[0019] First, clean the surface of the copper foil in distilled water at 100°C to remove impurities such as oil stains on the surface, take it out after 30 minutes, dry it under vacuum at 105°C for 3 hours, and then cool it to room temperature in vacuum.
[0020] BiTiO doped with La and Mn 3 is the sputtering target, metal copper foil is the sputtering substrate, and the chamber is pre-evacuated to 5×10 -3 Pa, and then argon gas is introduced into the cavity, and the pressure in the cavity is controlled to be 1.5 Pa to heat the base copper foil to 500°C. The parameters of the equipment are: RF power: 100W, accelerating voltage: 200V, current density: 30mA / cm 2 , the distance between the sputtering target and the substrate is 60mm, and the speed of the substrate is 2m / min. Cool to room temperature in argon after sputtering.
[0021] After passing through the radio frequency magnetron sputtering process, it was first cleaned with distilled water, then dried in vacuum at 105 °...
Embodiment approach 2
[0025] Clean the surface of the copper foil in distilled water at 100°C to remove impurities such as oil stains on the surface, take it out after 50 minutes, dry it under vacuum at 105°C for 2.5 hours, and then cool it to room temperature in vacuum.
[0026] BiTiO doped with La and Mn 3 is the sputtering target, metal copper foil is the sputtering substrate, and the chamber is pre-evacuated to 5×10 -3 Pa, and then argon gas is introduced into the cavity, and the pressure in the cavity is controlled to be 1.5 Pa to heat the base copper foil to 700°C. The parameters of the equipment are: RF power: 120W, accelerating voltage: 240V, current density: 40mA / cm 2 , the distance between the sputtering target and the substrate is 70 mm, and the speed of the substrate is 4 m / min. Cool to room temperature in argon after sputtering.
[0027] After passing through the radio frequency magnetron sputtering process, it was first cleaned with distilled water, then dried in vacuum at 105 °C f...
Embodiment approach 3
[0031] First, clean the surface of the copper foil in distilled water at 100°C to remove impurities such as oil stains on the surface, take it out after 60 minutes, dry it under vacuum at 105°C for 2 hours, and then cool it to room temperature in vacuum.
[0032] BiTiO doped with La and Mn 3 is the sputtering target, metal copper foil is the sputtering substrate, and the chamber is pre-evacuated to 5×10 -3 Pa, and then argon gas is passed into the cavity, and the pressure in the cavity is controlled to be 1.5 Pa to heat the base copper foil to 800°C. The parameters of the equipment are: RF power: 140W, accelerating voltage: 300V, current density: 50mA / cm 2 , the distance between the sputtering target and the substrate is 90 mm, and the speed of the substrate is 6 m / min. Cool to room temperature in argon after sputtering.
[0033] After passing through the radio frequency magnetron sputtering process, it was first cleaned with distilled water, then dried in vacuum at 105 °C ...
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