Moisture-curable hot melt adhesive
A hot-melt adhesive, moisture-curing technology, applied in the direction of adhesive types, ester copolymer adhesives, polyurea/polyurethane adhesives, etc. problem, to achieve excellent light resistance, improved light resistance, excellent light resistance and durability
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Embodiment 1-10 and comparative example 1-7
[0139] According to the formulations shown in Table 1 and Table 2, the raw materials were mixed to prepare a moisture-curable hot melt adhesive.
[0140] Specifically, all raw materials except the isocyanate compound were charged into a reaction vessel, heated to 120° C., and then stirred under reduced pressure for 1 hour. After removing moisture, an isocyanate compound (xylylene diisocyanate) was added at the same temperature, followed by stirring under reduced pressure for 2 hours to obtain a moisture-curable hot melt adhesive.
[0141] An ultraviolet irradiation test was conducted in order to evaluate the light resistance of the moisture-curable hot-melt adhesives of Examples and Comparative Examples. In addition, a high pressure cocker test was performed as an accelerated test in order to evaluate durability against high temperature and high humidity.
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