Liquid crystal glass substrate double-cutter wheel cutting device and method

A technology of liquid crystal glass substrate and cutting device, applied in glass cutting device, glass manufacturing equipment, manufacturing tools and other directions, can solve the problems of inability to obtain cutting effect, unstable laser processing, easy to produce fragments, etc., and achieve high cutting surface quality, Simple structure and easy operation

Active Publication Date: 2014-08-27
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Laser cutting is a highly nonlinear process and is affected by many factors, making laser processing unstable
[0004] As the most mature technology, mechanical cutting technology is the most used in production. The disadvantage of this processing method is that there is a large residual stress,

Method used

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  • Liquid crystal glass substrate double-cutter wheel cutting device and method
  • Liquid crystal glass substrate double-cutter wheel cutting device and method
  • Liquid crystal glass substrate double-cutter wheel cutting device and method

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Embodiment Construction

[0029] The present invention will be further described in detail in conjunction with the accompanying drawings and specific embodiments.

[0030] like figure 1 As shown, the double cutter wheel cutting method for liquid crystal glass substrates uses two cutter wheels to cut the liquid crystal glass substrate successively along the feeding direction indicated by the arrow. Feed cutting, followed by the following wheel (the left wheel) cutting with a higher cutting feed. The cutting feed mentioned here refers to the depth that the knife wheel cuts into the liquid crystal glass substrate.

[0031] like figure 2 As shown, the liquid crystal glass substrate double-knife wheel cutting device is composed of a support frame, a knife wheel fixture, a knife holder, a locking screw, a Y-axis screw, a Y-axis drive motor, an X-axis screw, an X-axis drive motor and a control computer. composition. Wherein, the Y-axis screw, the Y-axis driving motor, the X-axis screw, and the X-axis dri...

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PUM

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Abstract

The present invention relates to a liquid crystal glass substrate double-cutter wheel cutting device which comprises a support frame, a translation mechanism and a cutting tool assembly, a liquid crystal glass substrate is fixed on the support frame, the cutting tool assembly moves on the support frame through the translation mechanism; the cutting tool assembly comprises two cutter wheels, the two cutter wheels are arranged along the same cutting path, one cutter wheel is arranged in front of the other cutter wheel, the cutting feed rate of the front cutter wheel is less than that of the rear cutter wheel. The invention also relates to a liquid crystal glass substrate double-cutter wheel cutting method. The liquid crystal glass substrate double-cutter wheel cutting device uses ordinary cutter wheels to obtain the cutting depth processed by a high permeability cutter wheel, has the advantages of simple structure, low cost, and efficient completion of simultaneous cutting processing of the front and the rear cutter wheels by one time of cutter feeding, and belongs to the technical field of glass cutting.

Description

technical field [0001] The invention belongs to the technical field of glass cutting, and specifically relates to a more efficient and low-cost liquid crystal glass substrate double-knife wheel cutting device and method, which can complete the cutting process of the liquid crystal glass substrate. Background technique [0002] Liquid crystal display (LCD) glass has been widely used in the fields of optical communication, optoelectronics, information storage, aerospace, microelectronics and life sciences. In production, multiple liquid crystal displays are usually processed on larger glass, and then cut into small units. Cutting is one of the important steps in the manufacturing process of liquid crystal display devices. At present, the main processing methods include laser cutting technology and mechanical cutting technology. [0003] Laser cutting is a highly nonlinear process and is affected by many factors, making laser processing unstable. [0004] As the most mature t...

Claims

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Application Information

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IPC IPC(8): C03B33/02
Inventor 万珍平温万昱陆龙生汤勇
Owner SOUTH CHINA UNIV OF TECH
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