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Semiconductor device

A technology of semiconductors and power semiconductors, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve the problem of difficulty in reducing the size sufficiently

Active Publication Date: 2018-03-09
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to sufficiently reduce the size of each terminal block made of a resin material and having a recessed portion and a partition wall in consideration of the strength, withstand voltage, and handling accuracy of the resin-made terminal block

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example ）

[0026] Hereinafter, a semiconductor device 10 according to an embodiment of the present disclosure will be described with reference to the accompanying drawings. Such as figure 1 As shown, the semiconductor device 10 includes a pulse width modulation (PWM) inverter circuit. In this embodiment, as an example, the inverter circuit is provided by a three-phase inverter. Specifically, the semiconductor device 10 includes a semiconductor chip group 12 having six semiconductor chips 12a to 12f and terminals 14 corresponding to the semiconductor chips 12a to 12f. That is, the semiconductor device 10 has a 6-in-1 package. In the semiconductor device 10, the axis along which the terminals 14 protruding from the same side surface of the semiconductor device are arranged is defined as the X axis, and the longitudinal axis of each terminal 14 perpendicular to the X axis is defined as the Y axis, perpendicular to the X axis. The axis of the X-axis and the Y-axis is defined as the Z-axis...

no. 2 example ）

[0063] A semiconductor device 10 according to a second embodiment of the present disclosure will be described below. In the following description, the description of the same or equivalent parts as those of the first embodiment will be omitted.

[0064] In this embodiment, the terminal 14 having the first portion 22 and the second portion 24 also has Figure 9 The twisted portion 26 is shown. The twisted portion 26 connects the first portion 22 and the second portion 24 . In this embodiment, the first part is provided by a metal plate having a thickness. In the first portion 22, the direction along the thickness of the metal plate is perpendicular to the Y axis and parallel to or at an angle to the X axis. Other parts of the semiconductor device 10 according to the present embodiment are similar to the semiconductor device 10 according to the first embodiment.

[0065] Such as Figure 9 to Figure 11 As shown, among the main terminals 14a of the terminals 14 protruding fro...

no. 3 example ）

[0075] A semiconductor device 10 according to a third embodiment of the present disclosure will be described below. In the following description, the description of the same or equivalent parts as those of the foregoing embodiments will be omitted.

[0076] In the present embodiment, the terminal 14 having the first portion 22 and the second portion 24 has at least one slit 28 in addition to the structure of the semiconductor device 10 according to the first embodiment or the second embodiment. The slit 28 extends from a first point to a second point along the Y axis. The first point is located inside the resin portion 16 between one inner end of the terminal 14 and the side surfaces 16c, 16d of the resin portion 16 from which the terminal 14 protrudes. The second point is located outside the resin portion 16 and is provided by the outer end of the terminal 14 . The slit 28 divides the outer end portion of the terminal 14 into at least two legs, and each of the two legs has ...

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PUM

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Abstract

A semiconductor device includes a semiconductor chip (12), a plurality of terminals (14) arranged in a first direction, and a resin portion (16) sealing the semiconductor chip and the terminals. The terminal protrudes from a side surface of the resin portion in the second direction, and includes at least one subsidiary terminal having a first portion (22) and a second portion (24). In the accessory terminal, the first longitudinal end of the first portion is located inside the resin portion, and the second portion is arranged adjacent to the first portion. Furthermore, the length ( H1 ) of the first portion is greater than the length ( H2 ) of the second portion in the third direction, and the length ( W1 ) of the first portion is smaller than the length ( W2 ) of the second portion in the first direction.

Description

technical field [0001] The present disclosure relates to a semiconductor device including a semiconductor chip, terminals, and a resin portion that seals the semiconductor chip and the terminals. Background technique [0002] As disclosed in JP2012-005301A (corresponding to US2012 / 0001227A1), a semiconductor device includes a semiconductor chip, terminals, and a resin portion that seals the semiconductor chip and the terminals. The terminals protrude toward the outside from the surface of the resin portion and are arranged in one direction. [0003] In JP2012-005301A, terminals of a main circuit of a semiconductor chip, also called main terminals, are arranged in one direction on a terminal board. The terminal board has a recessed portion between two adjacent main terminals. Also, a plurality of control terminals are arranged on different terminal boards in one direction, and the terminal boards have insulating partition walls having a rib shape and dividing the control te...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48
CPCH01L23/4822H01L23/49524H01L23/49551H01L23/49555H01L23/49562H01L23/49575H01L2924/0002H01L2924/00H01L25/0655
Inventor 米田秀司
Owner DENSO CORP