Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of led package assembly

A technology for LED packaging and LED chips, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of complex packaging structure, low product qualification rate, complex process, etc., and achieve simple preparation, low thermal resistance, and expanded application range. Effect

Active Publication Date: 2017-04-26
贵州中晟泰科智能技术有限公司
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the technique of this method is complicated, and the product qualified rate is lower
[0006] It can be seen from the above that the existing LED packaging generally uses LED chips or LED devices together with hard substrates such as aluminum substrates and ceramic substrates, and the resulting packaging structure is relatively complicated.
In addition, there is a multi-layer structure between the LED chip and the heat sink, resulting in a large thermal resistance
In addition, the traditional packaging structure is mostly suitable for the use of blue-ray chips with dispensing process solutions, the process is cumbersome, and the product qualification rate is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of led package assembly
  • A kind of led package assembly
  • A kind of led package assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The present invention will be described below by taking an LED packaging assembly capable of emitting white light as an example and in conjunction with the accompanying drawings.

[0025] figure 1 A white LED package assembly according to a first embodiment of the present invention is shown. Such as figure 1 As shown, the white LED packaging assembly 10 includes a flexible substrate 11 on which a circuit layer 14 is formed. The flexible substrate 11 and the circuit layer 14 therein can be made of common materials and common processes well known in the art.

[0026] A reflective layer 15 is coated on the first side of the flexible substrate 11, and the first side is figure 1 shown as the upper side. In one embodiment, the reflective layer 15 may be a white oil layer. An LED chip 16 is also installed on the first side of the flexible substrate 11 . In this embodiment, the LED chip 16 is a white LED flip chip. Preferably, the white LED flip chip is surrounded by a h...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an LED (light-emitting diode) package assembly which comprises a flexible substrate, a reflection layer, an LED chip and a protective layer, wherein the flexible substrate is formed with a circuit layer, the reflection layer is arranged on a first side of the flexible substrate, the LED chip is arranged on the flexible substrate, an electrode of the LED chip passes through the reflection layer to be electrically connected with the circuit layer, and the protective layer is arranged on a second side of the flexible substrate. The LED package assembly according to the invention is provided with the flexible substrate, the application range of the LED package assembly is expanded, moreover, the substrate of the LED package assembly has a simple structure, so that formed heat resistance is low, and the LED package assembly is simple to fabricate and is low in production cost.

Description

technical field [0001] The present invention relates to a light emitting diode (LED), in particular to an LED packaging assembly, especially a white LED packaging assembly. Background technique [0002] LED can convert electrical energy into light energy with high efficiency, and has the characteristics of low current consumption and long service life. Therefore, LEDs can be applied not only to display devices, but also to lighting fixtures. In recent years, LED has been widely used in various lighting fields as a new type of light source. [0003] At present, for traditional LED packaging devices, LED chips are generally used in conjunction with mounting brackets, and then they are fixed together on an aluminum substrate. Afterwards, the aluminum substrate is thermally connected to the heat sink. However, this preparation method has the disadvantage of high thermal resistance. In order to reduce thermal resistance, another mainstream packaging structure is to directly m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/486H01L33/642H01L2933/0075
Inventor 袁长安韦嘉梁润园黄洁莹崔成强张国旗
Owner 贵州中晟泰科智能技术有限公司