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Chip arrangement, chip package, and method for manufacturing a chip arrangement

A chip packaging and chip technology, applied in the fields of chip layout, chip packaging, and manufacturing of chip layout, can solve problems such as unsuitability for chips, adverse effects of IC packaging stress, etc.

Active Publication Date: 2018-05-15
INTEL MOBILE COMM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such chips, for example, may require free headroom in order to function properly, and / or may be adversely affected by stress (e.g. mechanical stress) in the IC package
Therefore, current IC packages may not be suitable for such chips, and new ways of packaging such chips may be required

Method used

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  • Chip arrangement, chip package, and method for manufacturing a chip arrangement
  • Chip arrangement, chip package, and method for manufacturing a chip arrangement
  • Chip arrangement, chip package, and method for manufacturing a chip arrangement

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Embodiment Construction

[0020] The following detailed description refers to the accompanying drawings, which show, by way of illustration, specific details and aspects in which the invention may be practiced. These aspects are described in sufficient detail to enable those skilled in the art to practice the invention. Others may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention. The various aspects are not necessarily mutually exclusive, as some aspects can be combined with one or more other aspects to form new aspects. The description is directed to various aspects of a structure or device, and the description is directed to various aspects of a method. It will be appreciated that one or more (eg, all) aspects described in connection with a structure or device may be equally applicable to a method, and vice versa.

[0021] The word "exemplary" is used herein to mean "serving as an example, instance, or instance." Any ...

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PUM

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Abstract

The invention relates to a chip arrangement, a chip package, and a method for manufacturing a chip arrangement. The chip arrangement may include a semiconductor chip; an encapsulation layer at least partially encapsulating the semiconductor chip, the encapsulation layer having a receiving area configured to receive an electronic device, the receiving area including a cavity; and the electronic device disposed in the receiving area.

Description

technical field [0001] Various aspects relate to chip arrangements, chip packaging and methods for manufacturing the chip arrangements. Background technique [0002] In manufacturing an integrated circuit (IC), the IC (which may also be referred to as a chip or die) may be packaged prior to integration and / or distribution with other electronic components. The packaging may include potting the chip in a material and providing electrical contacts on the exterior of the package to provide an interface to the chip. Among other things, chip packaging can provide protection from surrounding air or contaminants, provide mechanical support, dissipate heat and reduce mechanical damage. [0003] As the demand for greater capabilities and features of ICs increases, chips including, for example, sensors, oscillators, and microelectromechanical systems (MEMs) may be included in IC packages. Such chips, for example, may require free headroom in order to function properly, and / or may be ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L25/00H01L21/56
CPCB81B2207/07B81B2207/096B81C1/0023B81C2203/0792H01L23/055H01L23/3128H01L24/19H01L25/0657H01L25/16H01L2224/12105H01L2224/16145H01L2224/16225H01L2224/2518H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73259H01L2224/73265H01L2225/0651H01L2225/06548H01L2225/06572H01L2924/07802H01L2924/07811H01L2924/12042H01L2924/1461H01L2924/15153H01L2924/15311H01L2924/1815H01L2924/351H01L2924/00H01L2924/181
Inventor A.沃尔特T.迈尔
Owner INTEL MOBILE COMM GMBH