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Equipment for connecting semiconductor devices without scratching the interface fingers

A finger and connector technology, applied in the field of equipment that connects semiconductor devices without scratching the interface finger

Inactive Publication Date: 2017-09-15
SANDISK INFORMATION TECH SHANGHAI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has been found that inserting edge connector 30 into interface slot 44 and removing edge connector 30 from interface slot 44 results in scratches on contact fingers 32

Method used

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  • Equipment for connecting semiconductor devices without scratching the interface fingers
  • Equipment for connecting semiconductor devices without scratching the interface fingers
  • Equipment for connecting semiconductor devices without scratching the interface fingers

Examples

Experimental program
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Embodiment Construction

[0028] will refer to Figures 3 to 20 To describe the present technology, which in an embodiment involves a carrier including a connector that electrically and physically secures a memory assembly within the carrier without damaging the fingers of the memory assembly. It will be appreciated that the invention may be embodied in many different forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the invention to those skilled in the art. Indeed, the invention is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the invention as defined by the appended claims. Additionally, in the following detailed description of the invention, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to on...

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PUM

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Abstract

Method and apparatus for testing semiconductor devices without scratching interface contacts. A carrier is disclosed for receiving a memory assembly for supporting the memory assembly during electrical testing of the memory assembly. The carrier includes a connector having a base and a cover pivotally mounted to the base and capable of snapping to the base. The base includes a first set of contact pins electrically coupled to contact fingers on a first surface of the memory assembly when the memory assembly is in the carrier. The cover includes a second set of contact pins electrically coupled to the contact fingers on the second surface of the memory assembly when the cover is snapped to the base. The first and second sets of contact pins transmit power, ground, and signals from the memory assembly to the edge connector of the carrier when the cover is snapped onto the substrate.

Description

Background technique [0001] The strong growing need for portable consumer electronics has boosted the demand for high-capacity storage devices. Non-volatile semiconductor memory devices, such as flash memory cards, are becoming more widely used to meet the growing demand for digital information storage and exchange. Their portability, versatility and stable design, as well as their high reliability and large capacity have made such memory devices ideal for use in a variety of electronic equipment including, for example, digital cameras, digital music players, video game consoles, PDAs and cellular phone. [0002] One use of flash memory devices is for so-called solid state disks (SSDs). An SSD is a semiconductor device for storing data that includes an electrical interface compatible with a conventional input / output hard disk drive interface. SSDs offer advantages over traditional hard drives, including the absence of moving parts, and are now being used in platforms that p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C29/56
Inventor 俞志明J.袁G.辛姬忠礼钱开友孔建庆廖致钦蔡健斌
Owner SANDISK INFORMATION TECH SHANGHAI