Flip chip bonding apparatus and flip chip bonding method

Abstract

Disclosed are a flip chip bonding device and a flip chip bonding method capable of delivering a flip chip from a flip over picker to a bonding picker. According to an embodiment of the present invention, the flip chip bonding device includes a wafer supply part supplying a wafer including multiple semiconductor chips, a picker unit picking up a semiconductor chip from the wafer, a bonding picker picking up the semiconductor chip from the picker unit to embed the chip in a substrate, a soaking unit soaking a lower bump of the semiconductor chip picked up by the bonding picker in a flux, an up-looking vision checking a lower surface of the semiconductor chip soaked in the flux of the soaking unit and picked by the bonding picker, a flux vision checking a flux state of the soaking unit, an operating part transferring at least one of the bonding picker and the flux vision to a x-y flat spot, and a bonding table in which the substrate is placed. The semiconductor chip picked by the bonding picker is checked after being soaked in the flux by the up-looking vision while at the same time flux vision checks the soaking unit.

Description

technical field [0001] The present invention relates to a flip-chip bonding device and a flip-chip bonding method, and in more detail, to a flip-chip that inspects the bonding state of the flip-chip before and after dipping the solder. A chip bonding device and a flip chip bonding method. Background technique [0002] Generally, a process for attaching a semiconductor chip to a circuit substrate needs to be performed very precisely, and a plurality of mounting areas for fixing the semiconductor chip are provided on the substrate. On the other hand, the mounting area of ​​the semiconductor chip and the circuit board should be electrically connected accurately, and the semiconductor chip should be mounted on the exact position (pattern) of the mounting area in order to reduce the defective rate. [0003] The semiconductor chip mounting process described above may be called a bonding process. Depending on the particularity of the process requiring precise work, the semiconduc...

AI Technical Summary

Problems solved by technology

The bonding head can be accelerated or decelerated at a high speed during the conveying process. When the acceleration or deceleration process is repeated, the components constituting each conveying line vibrate and generate heat. Reduced teleport position accuracy

[0007] Specifically, the positional information of the semiconductor chip and the positional information about the mounting area of ​​the circuit board cannot be accurately obtained due to thermal expansion and vibration, resulting in an increase in the defect rate and a decrease in the reliability and accuracy of the bonding process.

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