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Multi-helical substrate and three-dimensional package with same

A three-dimensional packaging and substrate technology, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., can solve problems such as limitations and achieve the effect of increasing the number

Active Publication Date: 2018-05-29
NXP USA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the number of input / output (I / O) contacts (contacts) used for electrical connection between the IC die in the package and an external device, as well as the number of stacked die are limited

Method used

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  • Multi-helical substrate and three-dimensional package with same
  • Multi-helical substrate and three-dimensional package with same
  • Multi-helical substrate and three-dimensional package with same

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Embodiment Construction

[0017] The detailed description of the drawings is intended as a description of presently preferred embodiments of the invention and is not intended to represent the only forms in which the invention may be practiced. It should be understood that the same or equivalent function can be realized by different embodiments, and it is intended that these embodiments also fall within the spirit and scope of the present invention.

[0018] refer to figure 1 , shows a schematic diagram of a substrate 10 for a 3D package according to an embodiment of the present invention. The substrate 10 comprises a cylindrical part 11, the cylindrical part 11 comprises a side wall 14, a first end surface 12 and a second end surface opposite to the first end surface 12 and figure 1 is not visible in .

[0019] The base plate 10 further includes a plurality of steps / steps 151 and 152 disposed along the sidewall 14 of the cylindrical member 11. Steps / steps 151 are arranged in the form of a helix that...

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Abstract

The present invention relates to a three-dimensional package, a substrate for a three-dimensional package, and a method of manufacturing a three-dimensional package. The three-dimensional package includes: a substrate including a cylindrical member having a sidewall; and steps or steps provided along the sidewall of the cylindrical member in the form of a plurality of spirals spiraling around the cylindrical member. Semiconductor integrated circuits (IC dies) are attached to one or both support surfaces of the steps. The cylindrical features, steps and IC die can be encapsulated with encapsulation material.

Description

technical field [0001] The present invention relates to semiconductor packages, and more particularly, to a substrate and a three-dimensional (3D) package having the same. Background technique [0002] Recently, with the advancement of integrated circuit (IC) technology, 3D packages have been developed. 3D packaging involves stacking two or more integrated circuit (IC) dies within a single package or stacking and connecting completed packages. 3D packages offer significant size reductions compared to existing packages because they pack more circuitry per square centimeter of board space and per cubic centimeter of application space. Given these and many other advantages, 3D packages are capturing an increasing share of the IC packaging market. However, conventional 3D packaging uses stacked IC dies or includes stacking and connecting completed packages to combine more functions in one package. Accordingly, the number of input / output (I / O) contacts (contacts) used for elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/13H01L23/31H01L25/065H01L21/98
Inventor 王欢舒爱鹏姚树安
Owner NXP USA INC