A method of forming on-board capacitance through pcb wiring design
A wiring design and capacitance technology, applied in the direction of multilayer circuit manufacturing, containing printed electrical components, etc., can solve the problems of poor application flexibility, limited application range, and shortened service life, so as to improve the applicable range and reduce the cost. Consumption, the effect of improving accuracy
Active Publication Date: 2017-05-31
HUIZHOU KING BROTHER CIRCUIT TECH +2
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] Existing printed circuit boards need to design relevant graphics on the board, and place capacitors on the relevant graphics through plug-in or placement or other methods to achieve the expected effect; the capacitance of the installed capacitors is fixed, and the flexibility of application is poor.
And to a certain extent, the volume of the product is increased, which limits the scope of application of the product
At the same time, the welding and installation of capacitors generally adopts heat welding, which will have a certain impact on peripheral components or printed circuit boards, shorten the service life of printed circuit boards and their peripheral components, and affect product stability.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0022] In order to facilitate the understanding of those skilled in the art, the structural principle of the present invention will be further described in detail below in conjunction with specific embodiments.
[0023] A method of forming on-board capacitance through PCB layout design, which includes
[0024] Step 1, determine the capacitance distribution area of the same layer of circuit board or the capacitance distribution area between different layers according to the needs of the circuit layout, and design one or several of the capacitance distribution areas according to the needs of the layout design, and distribute in the capacitance distribution area One or several upper capacitors;
[0025] Step 2: Capacitors need to be formed on the same circuit board, and several capacitors are formed in the capacitance distribution area. Each capacitor forms several parallel lines by transferring and etching the copper-clad substrate pattern. There is a dielectric material betwe...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a method for forming on-board capacitors through a PCB wiring design. A capacitor distribution area on the same layer of circuits boards or capacitor distribution areas among different layers is / are determined according to a circuit design; when the capacitors need to be arranged in the same layer of circuit boards, the multiple capacitors are formed in the capacitor distribution areas, each capacitor is composed of a plurality of parallel circuits, and each set of separated and parallel circuits are made into electrodes through conduction current of the circuits or via holes; when the capacitors need to be arranged on the capacitor distribution areas among different layers, the capacitors are formed by a plurality of symmetrical circuits among different layers, and each set of separated and symmetrical circuits are made into electrodes through conduction current of the circuits, and a PCB is manufactured through a subsequent PCB manufacturing process. The method for forming the on-board capacitors through the PCB wiring design has the advantages that manufacturing is simple, the capacitors can be arranged inside conveniently, the size is within an accurate control range, the capacitance value differentiation is small, and stability and reliability are achieved.
Description
technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for forming capacitance on the board through PCB wiring design. Background technique [0002] Existing printed circuit boards need to design relevant graphics on the board, and place capacitors on the relevant graphics through plug-in or placement or other methods to achieve the expected effect; the capacitance of the installed capacitors is fixed, and the flexibility of application is poor. . And to a certain extent, the volume of the product is increased, which limits the scope of application of the product. At the same time, the welding and installation of capacitors is generally done by heat welding, which will have a certain impact on peripheral components or printed circuit boards, shorten the service life of printed circuit boards and their peripheral components, and affect product stability. Contents of the invention [0003] The object of...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/16
Inventor 陈春林映生刘敏王成谷
Owner HUIZHOU KING BROTHER CIRCUIT TECH