Method for copperizing and silvering on surface of glass bead, and copperized and silvered glass bead

A technology of glass microspheres and copper plating, which is applied in the field of electromagnetic shielding material preparation, can solve the problems of increased density of conductive rubber and conductive adhesive, increased material cost, and high filling volume, so as to reduce material cost and use cost , weight reduction, good heat resistance

Active Publication Date: 2014-10-15
重庆新福佰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, silver powder and copper-plated silver powder have a common shortcoming, that is, high density. These powders have a high filling amount in the adhesive, accounting for about 75%-85% of the total weight, resulting in conductive rubber and conductive adhesives for final electromagnetic shielding materials. Increased density increases the cost of materials used

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Taking the preparation of glass beads with a copper plating amount of 20wt% and a silver plating amount of 5wt% as an example, the preparation method comprises the following steps:

[0030] 1) Impurity removal: placing 80 g of glass beads with a particle size of 30 μm in 200 ml of NaOH solution with a concentration of 30 wt %, stirring at 40° C. for 20 minutes to remove impurities such as oil stains on the surface of the glass beads, then filtering and Rinse with clean water until neutral;

[0031] 2) Coarsening: place the impurity-removed glass microspheres in 100ml of 20wt% hydrofluoric acid solution, stir at 100rp at 35°C for 15 minutes, filter, and wash with water until neutral. ;

[0032] 3) Sensitization: place the roughened glass microspheres in 500ml of sensitization solution, filter them after sensitization treatment at 30°C for 20 minutes, and wash them with water until they are neutral for later use; wherein, the sensitization The chemical solution is a mix...

Embodiment 2

[0036] Taking the preparation of glass beads with 40wt% copper plating and 8wt% silver plating as an example, the preparation method comprises the following steps:

[0037] 1) Impurity removal: 60 g of glass beads with a particle size of 30 μm are placed in 200 ml of NaOH solution with a concentration of 30 wt %, stirred at 40° C. for 20 minutes to remove impurities such as oil stains on the surface of the glass beads, then filtered and Rinse with clean water until neutral;

[0038] 2) Coarsening: place the impurity-removed glass microspheres in 100ml of 20wt% hydrofluoric acid solution, stir at 100rp for 15 minutes at 35°C, filter, and wash with water until neutral. ;

[0039] 3) Sensitization: place the roughened glass microspheres in 500ml of sensitization solution, filter them after sensitization treatment at 30°C for 20 minutes, and wash them with clear water until they are neutral for later use; wherein, the sensitization The chemical solution is a mixture of stannous ...

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Abstract

The invention discloses a method for copperizing and silvering on the surface of a glass bead. The method comprises the steps that 1) alkaline cleaning and coarsening pretreatment is performed; 2) sensitizing treatment is performed on the glass bead by a sensitizing solution; 3) reduction copperizing treatment is performed on the glass bead by a reduction solution in a copperizing solution; and 4) replacement silvering treatment is performed on the copperized glass bead by a silver ammonia solution in a silvering solution, and then the copperized and silvered glass bead in a double-layer structure is obtained. The volume resistivity of the glass bead is less than or equal to 10<-3>omega.cm; the glass bead has the characteristics of uniform plating, low density, good conductivity, good storage capability and the like; and the method is suitable for preparing conductive compounds such as conductive rubber, a conductive coating and a conductive adhesive.

Description

technical field [0001] The invention relates to a preparation method of an electromagnetic shielding material, in particular to a method for copper-plating and silver-plating on the surface of glass beads, and also relates to a copper-plated and silver-plated glass bead prepared by the method. Background technique [0002] With the development of the electronics industry, computers, information processing equipment, electronic communication equipment and other electrical equipment have been widely used in various industries as the carrier of information technology, which has brought great convenience to human beings. However, the electromagnetic radiation produced by the equipment , Electromagnetic pollution has become a social problem that cannot be ignored. Since conductive materials can achieve excellent shielding performance by reflecting electromagnetic waves in high-frequency bands, the use of conductive rubber and conductive adhesives is an effective means to prevent ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C17/40
Inventor 何平
Owner 重庆新福佰科技有限公司
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