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Cover film and copper clad laminate using same

A technology of copper-clad laminate and cover film, which is applied in the direction of film/sheet release coating, film/sheet adhesive, coating, etc., can solve the problems that are difficult to meet, and achieve the suppression of white turbidity and excellent transparency The effect of resistance and heat resistance

Active Publication Date: 2018-05-04
ARISAWA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the film itself using a polyimide (PI) film (film, film) is yellow, and it is difficult to meet the above requirements.

Method used

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  • Cover film and copper clad laminate using same
  • Cover film and copper clad laminate using same
  • Cover film and copper clad laminate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0103] Hereinafter, although an Example and a comparative example demonstrate this invention further concretely, this invention is not limited to these Examples.

[0104] In Examples and Comparative Examples, measurement and evaluation of various physical properties were performed by the following methods.

[0105] (1) Thickness

[0106] Measurement was performed with a micrometer prescribed in JIS B 7502.

[0107] (2) Glass transition temperature

[0108] The kinetic viscosity when the temperature was raised at a rate of 10° C. / min was measured using a dynamic viscosity measuring device RSA II manufactured by American Rheology Co., Ltd., and Tg was obtained from the maximum value of tan δ.

[0109] (3) Melt viscosity

[0110] Using Rheosol-G3000 manufactured by Japan UBM Co., Ltd., the temperature of the sample was raised at a rate of 10° C. / min, and the dynamic viscosity in the range of 100° C. to 160° C. was measured. Here, the dynamic viscosity means the viscosity when...

manufacture example 1

[0129] Add 100 parts by mass of methyl ethyl ketone, 5 parts by mass of UV initiator (manufactured by Ciba Specialty Chemicals Co., Ltd., DarocureTPO) and 100 parts by mass of acrylic acid ester (manufactured by Daicel-Cytec Co., Ltd., PETA-K). Stirring was carried out at room temperature to obtain a resin composition 1 for a hard coat layer.

manufacture example 2

[0131] Add 100 parts by mass of methyl ethyl ketone, 5 parts by mass of UV initiator (manufactured by Ciba Specialty Chemicals Co., Ltd., DarocureTPO), 50 parts by mass of acrylic acrylate (manufactured by Daicel-Cytec Co., Ltd., PETA-K) and different 50 parts by mass of a type of acrylic acrylate (manufactured by Daicel Cytec Corporation, PEG400DA) was stirred at room temperature to obtain a resin composition 2 for a hard coat layer.

[0132] Adhesive resin composition

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Abstract

The present invention provides a cover film and a copper-clad laminate using the same, which have excellent transparency and heat resistance, and significantly suppress white turbidity caused by oozing of oligomer components in a high-temperature environment. Wherein, the cover film is a cover film comprising a transparent film layer having a first surface and a second surface, a hard coat layer and an adhesive layer, the above-mentioned first surface of the above-mentioned transparent film layer is laminated with the above-mentioned hard coat layer, and the above-mentioned transparent film layer The above-mentioned second surface of the film layer is laminated with the above-mentioned adhesive layer, and the total light transmittance is above 85%.

Description

technical field [0001] The present invention mainly relates to cover films for flexible printed circuit boards and copper clad laminates. Background technique [0002] Polyimide film has many characteristics required for electronic materials such as high heat resistance and high strength, and is widely used in the field of flexible printed circuit boards (hereinafter, also abbreviated as "FPC"). However, even in the field of FPC, for example, in cosmetic applications requiring high appearance characteristics, it is required to use an FPC which is inherently transparent in order to effectively transmit light. Specifically, a case where a transparent FPC is used in a mobile phone or the like is mentioned. However, the film itself using a polyimide (PI) film (film) appears yellow, and it is difficult to satisfy the above-mentioned requirements. [0003] In order to meet the above-mentioned required characteristics, products using colorless and transparent films such as polyet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/20C09J7/50B32B33/00C09D4/02B32B15/08B32B15/20H05K1/02
Inventor 长谷川慎一近藤由惠松井悟史吉田茂树
Owner ARISAWA MFG CO LTD