Heat dissipation module and diversion structure thereof

Abstract

Provided are a heat dissipation module and a diversion structure thereof. The heat dissipation comprises a fan and a diversion structure. The fan has a frame equipped with an air outlet. The diversion structure has a diversion part which is adjacent to the air outlet of the frame. The diversion part has a combination surface for combination and fixing, and also has a diversion surface opposite to the combination surface. A position of the diversion surface, adjacent to the air outlet, is provided with a first end rim. A second end rim is formed in a position where the vertical distance between the diversion surface and the combination surface is the maximum distance. The diversion surface includes at least one non-parallel surface which is not parallel to the combination surface. The heat dissipation module is equipped with the diversion structure by means of the air outlet of the fan, so that the flow direction of air produced by the fan is effectively changed, the air is directly blown toward a heat source, and then heat dissipation effects of the heat dissipation module are improved.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module with a flow guide structure to provide better heat dissipation effect. Background technique [0002] Such as figure 1 As shown, China Taiwan Announcement No. I265776 "Electronic Device with Heat Dissipation Module" patent case, the patent case discloses a commonly used electronic device 8, including a heat source 81 and a heat dissipation module 82 in the prior art. In the technology, the cooling module 82 has a fan 821 and a heat pipe 822, and the two ends of the heat pipe 822 are respectively connected to the heat source 81 and the air outlet of the fan 821; The generated heat is conducted to the air outlet of the fan 821 , and the fan 821 is driven to operate to dissipate heat from the heat source 81 . [0003] However, since the existing heat dissipation module 82 must be provided with the heat pipe 822, the production cost of the commonly used electron...

AI Technical Summary

Problems solved by technology

[0005] However, the heat source 91 may be a flat structure such as an integrated circuit chip or a printed circuit board, so that when the airflow generated by the fan 92 is blown out from the air outlet 921, the contact area with the heat source 91 is relatively small. In other words, The air flow of the fan 92 will pass through the surface of the heat source 91 quickly, and cannot directly blow to the heat source 91

Therefore, the heat dissipation module 9 can only take away the heat dissipated from the surface of the heat source 91, and it is difficult to get rid of the waste heat inside the heat source 91, and the heat dissipation effect is relatively poor.

[0006] In view of the above, it is indeed necessary to develop a further improved heat dissipation module to solve the problem of poor heat dissipation effect of the heat dissipation module 9 in the prior art

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