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High-temperature-resistant pressure-sensitive adhesive and preparation method thereof

A pressure-sensitive adhesive and high-temperature resistance technology, applied in the field of pressure-sensitive adhesives, can solve the problems of high temperature resistance, poor acid and alkali corrosion resistance, and peeling strength that cannot meet the requirements of use, and achieve high temperature resistance and acid and alkali corrosion resistance. The effect of improving, the preparation method is simple

Inactive Publication Date: 2014-10-29
SUZHOU SHIYOUJIA ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the peel strength of tapes for flexible printed circuit boards still cannot meet the requirements of use, and its high temperature resistance and acid and alkali corrosion resistance are poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] 40 kg of acrylate monomer; 5 kg of tackifying resin; 30 kg of solvent; 0.5 kg of initiator; 1 kg of curing agent; 5 kg of plasticizer; After homogenization, filter and heat preservation and defoaming.

[0021] The resulting material had a peel strength of 0.36 N / 25 mm at 180°C.

Embodiment 2

[0023] 45 kg of acrylate monomer; 8 kg of tackifying resin; 40 kg of solvent; 0.8 kg of initiator; 1.5 kg of curing agent; 10 kg of plasticizer; After stirring evenly, filter and keep warm for debubbling.

[0024] The resulting material had a peel strength of 0.38 N / 25 mm at 180°C.

Embodiment 3

[0026] 50 kg of acrylate monomer; 10 kg of tackifying resin; 50 kg of solvent; 1 kg of initiator; 2 kg of curing agent; 15 kg of plasticizer; After stirring evenly, filter and keep warm for debubbling.

[0027] The resulting material had a peel strength of 0.35 N / 25 mm at 180°C.

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PUM

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Abstract

The invention discloses a high-temperature-resistant pressure-sensitive adhesive and a preparation method thereof, wherein the pressure-sensitive adhesive comprises the following components in parts by weight: 40-50 parts of an acrylate monomer, 5-10 parts of a tackifying resin, 30-50 parts of a solvent, 0.5-1 part of an initiator, 1-2 parts of a curing agent, 5-15 parts of a plasticizer, and 2-4 parts of an antioxidant. Moreover, the preparation method comprises the steps: carrying out heat preservation stirring of 40-50 parts of the acrylate monomer, 5-10 parts of the tackifying resin, 30-50 parts of the solvent , 0.5-1 part of the initiator, 1-2 parts of the curing agent, 5-15 parts of the plasticizer and 2-4 parts of the antioxidant for 1-3 hours at the temperature of 150-180 DEG C, after stirring evenly, filtering, and carrying out heat preservation debubbling. The preparation method is simple and convenient, the peeling strength can satisfy the use requirement, and the high temperature resistance and the acid and alkali corrosion resistance are relatively greatly improved.

Description

technical field [0001] The invention relates to a pressure-sensitive adhesive, in particular to a high-temperature-resistant pressure-sensitive adhesive and a preparation method thereof. Background technique [0002] Pressure-sensitive adhesive is a pressure-sensitive adhesive, which is mainly used to prepare pressure-sensitive adhesive tapes. The existing pressure-sensitive adhesive tapes often suffer from degumming during use. [0003] Flexible printed circuit board refers to electronic components with wide application value that are bonded together with flexible plastic film and metal foil according to certain design requirements. During the processing of flexible printed circuit boards, the surface of the plastic film needs to be covered with a layer of adhesive tape for protection, support and die-cutting positioning. Since the peel strength of the tape is too large or too small, the performance of the surface to be pasted will be reduced or destroyed. Therefore, the p...

Claims

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Application Information

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IPC IPC(8): C09J4/02
Inventor 陈鑫
Owner SUZHOU SHIYOUJIA ELECTRONICS TECH