A kind of preparation method of glass fiber reinforced cross-linked polystyrene board

A technology of cross-linked polystyrene and polystyrene, which is applied in the field of efficient preparation of glass fiber reinforced cross-linked polystyrene boards, can solve the problems of insufficient mechanical strength of cross-linked polystyrene boards, achieve enhanced mechanical strength, and eliminate gaps , Improve the effect of mechanical strength

Inactive Publication Date: 2017-01-25
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention aims to solve the problem of insufficient mechanical strength of the existing cross-linked polystyrene board, and provides a preparation method of glass fiber reinforced cross-linked polystyrene board

Method used

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  • A kind of preparation method of glass fiber reinforced cross-linked polystyrene board
  • A kind of preparation method of glass fiber reinforced cross-linked polystyrene board
  • A kind of preparation method of glass fiber reinforced cross-linked polystyrene board

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preparation example Construction

[0024] The invention provides a kind of preparation method of glass fiber reinforced cross-linked polystyrene plate, it comprises the following steps:

[0025] 1) Mix styrene and divinylbenzene evenly, prepare a mixed solution of the two, in which the styrene is 95-99wt%, and the divinylbenzene is 1-5wt%;

[0026] 2) Mix the polystyrene powder with the above mixed solution at a mass ratio of 1:1 to 9, and stir at high speed until the solution is clear and transparent;

[0027] 3) Pour the chopped glass fiber with a diameter of 5-15 μm and a length of 3-30 mm into the γ-(methacryloyloxy)propyltrimethoxysilane (MPS) solution, take it out after soaking for 1 hour, and use a deionized Rinse with water to neutral, dry;

[0028] 4) Add the chopped glass fiber treated with the silane coupling agent into the clarified solution obtained in step 2), and stir at a high speed until the mixture is evenly mixed, wherein the glass fiber is added in an amount of 1 to 30% of the mass of the c...

Embodiment 1

[0034] 1) Add 1470g of styrene, 30g of divinylbenzene and 500g of polystyrene powder into the container, stir at high speed until the solution is clear and transparent.

[0035] 2) Take 400g of chopped glass fiber with a length of 12mm and pour it into the γ-(methacryloyloxy)propyltrimethoxysilane (MPS) solution, soak it for 1 hour, take it out, rinse it with deionized water until it is neutral, and dry it. Dry.

[0036] 3) Add the chopped glass fiber treated with silane coupling agent into the above clear liquid, stir until it is evenly mixed, pour it into a special mold that can isolate water and oxygen, and seal it.

[0037] 4) Under the temperature of 5°C, 20kGy of gamma rays are irradiated to the mold containing the sample, and the radiation dose rate is 40Gy / min.

[0038] 5) Open the mold and take out the fully cured glass fiber reinforced cross-linked polystyrene board, and machine it until the shape is regular and the surface is smooth.

[0039] 6) Put the processed ...

Embodiment 2

[0043] 1) Add 950g of styrene, 50g of divinylbenzene and 500g of polystyrene powder into the container, stir at high speed until the solution is clear and transparent.

[0044] 2) Take 150g of chopped glass fiber with a length of 30mm and pour it into γ-(methacryloyloxy)propyltrimethoxysilane (MPS) solution, soak it for 1 hour, take it out, rinse it with deionized water until it is neutral, and dry it Dry.

[0045] 3) Add the chopped glass fiber treated with silane coupling agent into the above clear liquid, stir until it is evenly mixed, pour it into a special mold that can isolate water and oxygen, and seal it.

[0046] 4) Perform 30kGy gamma-ray radiation on the mold containing the sample at a temperature of 0°C, and the radiation dose rate is 20Gy / min.

[0047] 5) Open the mold and take out the fully cured glass fiber reinforced cross-linked polystyrene board, and machine it until the shape is regular and the surface is smooth.

[0048] 6) Put the processed glass fiber r...

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Abstract

The invention discloses a preparation method of a glass fiber reinforced crosslinked polystyrene board. The method comprises the following steps: 1) dissolving of polystyrene powder: pouring the polystyrene powder into a mixed solution of styrene and divinylbenzene, and stirring to obtain a clear and transparent solution; 2) addition of glass fiber: adding chopped glass fiber treated with a silane coupling agent into the clear and transparent solution, and stirring for mixing evenly; 3) forming of high strength polystyrene board: pouring the mixture into a mold, sealing, radiating by using gamma rays, and solidifying the liquid until appearance of mechanical strength; and 4) post treatment of the high strength polystyrene board: conducting hot pressing on the above plastic board to obtain the glass fiber reinforced crosslinked polystyrene board. The glass fiber reinforced cross-linked polystyrene board prepared by the method is a high strength modified crosslinked polystyrene material with the mechanical strength 50% higher than common crosslinked polystyrene. The method has the advantages of high rate of finished products, low energy consumption and controllable size of prepared boards.

Description

technical field [0001] The invention belongs to the field of new polymer materials, and in particular relates to a method for efficiently preparing glass fiber-reinforced cross-linked polystyrene boards by using polystyrene powder as a raw material. Background technique [0002] Cross-linked polystyrene is a low-dielectric material with excellent performance. It has a dielectric constant of 2.3-2.5 in a wide frequency range of 500Hz, a dielectric loss within 0.1, and good machinability and dimensional stability. . In addition, cross-linked polystyrene also has good high-voltage breakdown resistance, large volume and surface resistivity, and extremely high radiation resistance. Therefore, it has excellent application prospects in microwave communication, semiconductor and other fields. [0003] With the development of science and technology, low-dielectric materials are required to work in some high-voltage and strong-pulse environments, which puts forward higher and higher...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/08C08J3/28C08J3/24C08L25/06C08K9/06C08K7/14
Inventor 朱泉峣俞悦牟广营孙华君王鹏彦陈文王钧王翔徐任信
Owner WUHAN UNIV OF TECH
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