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Solder-resisting-surface transmitted copper foil standard testing instrument and method

A detector and copper foil technology, applied in the field of detection, can solve the problem of low precision and achieve the effect of accurate test results

Inactive Publication Date: 2014-11-05
DALIAN EVERYDAY GOOD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a copper foil reference detector and detection method through the solder resist surface, and solves the problem of low accuracy in the copper foil position and area detection process by adopting the copper foil reference detection technology through the solder resist surface question

Method used

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  • Solder-resisting-surface transmitted copper foil standard testing instrument and method

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Embodiment Construction

[0017] Below in conjunction with accompanying drawing and embodiment the present invention is further described:

[0018] A copper foil benchmark detector through a solder resist surface, comprising: a video acquisition module 2, a light source 1, a laser emitting device 3, a substrate to be tested 4, an XY mobile platform, a PC and an electric control box; a laser emitting device 3, Including: a laser transmitter, a laser probe; the video acquisition module 2 includes a camera with a high-resolution charge-coupled element and a high-magnification industrial lens with a high depth of field; the video acquisition module 2 is arranged above the substrate 4 to be tested, and its two sides are respectively set There is a light source 1 and a laser emitting device 3; the video acquisition module 2 is used to photograph the substrate 4 to be tested, the light source 1 is used to provide brightness, the laser emitting device 3 emits laser stripes at an angle of 60 degrees or 90 degree...

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Abstract

The invention discloses a solder-resisting-surface transmitted copper foil standard testing instrument and method. The solder-resisting-surface transmitted copper foil standard testing instrument comprises a video collecting module used for shooting a substrate to be tested, a light source used for providing luminance, a laser emitting device used for emitting laser streaks and the substrate to be tested. The laser emitting device comprises a laser emitter and a laser probe. The video collecting module is arranged above the substrate to be tested, and the light source and the laser emitting device are arranged on the two sides of the video collecting module respectively. By means of the solder-resisting-surface transmitting copper foil standard testing instrument and method, poor testing caused by interference of a solder resisting layer is avoided, and therefore the testing result is accurate.

Description

technical field [0001] The invention relates to a detection technology, in particular to a copper foil benchmark detector and a detection method through a solder resist surface. Background technique [0002] Copper foil is a negative electrolytic material. It is a thin, continuous metal foil deposited on the base layer of the circuit board. As the conductor of the PCB, it is easily bonded to the insulating layer and accepts the printed protective layer. After corrosion Form a circuit pattern. Nowadays, as the components assembled on the circuit board are getting smaller and smaller, the assembly density of components is getting higher and higher, and the solder joints are getting smaller and smaller, so the copper foil detection benchmark is becoming more and more important. [0003] Most of the defects produced by soldered PCB boards come from the insufficient precision of solder paste printing, and the data provided by the copper foil surface benchmark detection is used a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/00G01B11/28
Inventor 宋作伟于龙义谭广有寇昌
Owner DALIAN EVERYDAY GOOD ELECTRONICS