Method of making a flexible circuit
A technology of flexible circuits and flexible substrates, applied in printed circuits, printed circuits, manufacturing tools, etc., can solve problems such as inapplicable lamination
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[0051] According to the first embodiment, the method for producing a multi-layer flexible PCB of any length is summarized as the following steps (a) to (k), hereinafter referred to Figure 1 to Figure 3 to describe.
[0052] It should be understood that, for simplicity, Figure 1 to Figure 8 The topology obtained by laminating the first and second substrates 10, 20 is not shown, but each layer is illustrated as a plane. For example, in practice the adhesive film 5 introduced below would be partially reflowed to partially planarize the topology of the patterned conductive layer, and the layer overlying the topology would bend to fit the topology; for simplicity, in It is not shown in the figure.
[0053] The method according to the first embodiment starts with (a) a first pre-lamination substrate 10 of suitable length comprising an unpatterned continuous metal conductive layer 2 on a continuous unpatterned insulator layer 1 . Such substrates 10 are well known to the skilled ...
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