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A heat dissipation layer, an electronic device with the same, and a manufacturing method of the electronic device

A technology for electronic devices and heat dissipation layers, which is applied in the production of electronic devices and electronic devices, in the field of heat dissipation layers, and can solve problems such as general thermal conductivity.

Active Publication Date: 2017-11-14
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing heat dissipation layer is generally metal film, copper foil or alloy foil, and its heat conduction effect is average.

Method used

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  • A heat dissipation layer, an electronic device with the same, and a manufacturing method of the electronic device
  • A heat dissipation layer, an electronic device with the same, and a manufacturing method of the electronic device
  • A heat dissipation layer, an electronic device with the same, and a manufacturing method of the electronic device

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] An embodiment of the present invention provides a heat dissipation layer, wherein a material forming the heat dissipation layer includes a topological insulator, and the heat dissipation layer is formed on a patterned surface of a substrate.

[0026] The material forming the heat dissipation layer includes a topological insulator, that is, the heat dissipation layer may be formed only of a topological insulator, or may be formed of a mixed material forme...

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Abstract

The invention provides a heat dissipation layer, an electronic device with the same and a production method for the electronic device, and relate to the field of electronic devices, which solve the problem of poor heat conduction effect of the existing heat dissipation layer of the existing electronic device. A material for forming the heat dissipation layer comprises a topological insulator, and the heat dissipation layer is formed on the patterned substrate surface.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a heat dissipation layer, an electronic device with the same and a manufacturing method of the electronic device. Background technique [0002] The use of most electronic devices is accompanied by the problem of heat dissipation. And problems such as uneven heat dissipation will also reduce the service life of electronic devices. Taking LED (Light Emitting Diode) as an example, the core light-emitting part of the LED has high requirements on temperature conditions, and if the temperature is too high after power-on, the luminous intensity will decrease and the service life will be greatly shortened. Therefore, a heat dissipation layer is generally provided in the electronic device to reduce the temperature of the core of the electronic device and prolong the service life of the electronic device. However, the existing heat dissipation layer is generally a metal film, copper foi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L23/373
Inventor 卢永春乔勇程鸿飞先建波
Owner BOE TECH GRP CO LTD