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Integrated circuit package having a split lead frame

A technology of lead frame and lead wire, which is applied in the direction of circuits, measuring devices, electrical components, etc.

Active Publication Date: 2014-12-10
ALLEGRO MICROSYSTEMS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Molding techniques, while providing cost-effective fabrication techniques, present challenges such as removing the device from the mold in a manner that does not subject the device to detrimental stress

Method used

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  • Integrated circuit package having a split lead frame
  • Integrated circuit package having a split lead frame
  • Integrated circuit package having a split lead frame

Examples

Experimental program
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Embodiment Construction

[0035] refer to figure 1 , a leadframe 10 for use in an integrated circuit includes a plurality of leads 14, 16, at least two of which (and here, the two illustrated leads comprising said plurality of leads) include respective bare The sheet attaching portions 24 , 26 and the connecting portions 34 , 36 . The lead frame 10 has a first surface 10a and an opposite second surface 10b ( figure 2 ). As will be explained, the die attach portion 24, 26 (sometimes referred to herein simply as the die portion) of each lead may have a semiconductor die ( figure 2 ).

[0036] The connection portion 34, 36 of each lead extends from a first end 34a, 36a adjacent the respective die portion 24, 26 to a second, distal end 34b, 36b remote from the die portion. Typically, the connecting portion 34, 36 of each lead is elongated and adapted to form an electrical connection to electronic systems and devices (not shown), such as a power supply or microcontroller, located outside the integrate...

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PUM

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Abstract

A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. The sensor further includes at least one wire bond coupled between the die and a first surface of the lead frame. The die is attached to a second, opposing surface of the lead frame in a lead on chip configuration. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

Description

technical field [0001] The present invention relates generally to integrated circuit packages, and more particularly, to integrated circuit packages with split leadframes. Background technique [0002] Techniques for semiconductor packaging are well known in the art. Typically, semiconductor die are cut from the wafer, processed, and attached to die attach pads of a leadframe. The subassembly can then be overmolded with plastic or other insulating and protective material to form an integrated circuit (IC) package. [0003] After packaging, the IC can then be placed on a circuit board with other components, including passive components such as capacitors, resistors, and inductors, which can be used for filtering and other functionality. For example, in the case of a magnetic field sensor integrated circuit including a magnetic field sensing element, devices such as capacitors are often required to reduce noise and enhance EMC (Electromagnetic Compatibility). [0004] Magne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R33/00H01L23/495
CPCG01R33/0052H01L2924/19105H01L2224/48257H01L2224/48091G01R33/0011G01R33/0047H01L43/02H01L2224/48247H01L2224/4826H01L2924/00014H10N50/80
Inventor W·P·泰勒P·戴维R·维格P·K·舍勒A·P·弗里德里克
Owner ALLEGRO MICROSYSTEMS LLC
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