Low-dielectric-constant polyimide film and preparation method thereof
A technology of polyimide film and low dielectric constant, which is applied in the field of low dielectric constant polyimide film and its preparation, can solve the problems of high production cost, environmental pollution, complex process, etc., and achieve uniform distribution and good Application prospect, effect of low dielectric constant
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Embodiment 1
[0029] In this embodiment, the low dielectric constant polyimide film material has the following structural formula:
[0030]
[0031] The specific preparation method is:
[0032] 1) Add 10.0g (0.05mol) 4,4'-diaminodiphenylether (ODA) to 90g N-methylpyrrolidone in a three-necked flask, then add 3,3',4,4'-di Phenyl ether tetracarboxylic dianhydride (ODPA) (the molar ratio of ODA and ODPA is 1:1), stirred at 25°C for 5h until all dissolved to obtain a homogeneous solution A, and the solid content of the solution was adjusted to 20%;
[0033] 2) Add melamine equivalent to 0.2 times the weight of polyimide in the beaker, then add N-methylpyrrolidone equivalent to 10 times the weight of melamine, stir rapidly with a glass rod and disperse ultrasonically for 5 minutes, and the obtained white paste Add it to solution A, and at the same time use mechanical stirring and ultrasonic dispersion to disperse melamine evenly in the resin to obtain solution B;
[0034] 3) Vacuum debubble...
Embodiment 2
[0044] In this embodiment, the low dielectric constant polyimide film material has the following structural formula:
[0045]
[0046] The specific preparation method is:
[0047] 1) Add 10.0g (0.05mol) of 3,4'-diaminodiphenyl ether (3,4'-ODA) to a three-necked flask and dissolve it in 110g of N-methylpyrrolidone, then add 3,3',4 , 4'-diphenyl ether tetracarboxylic dianhydride (ODPA) (the molar ratio of 3,4'-ODA and ODPA is 1.1:1), stirred at 30°C for 6h until all dissolved to obtain a homogeneous solution A, adjust the solution The solids content is 15%;
[0048] 2) Add melamine equivalent to 0.4 times the weight of polyimide in the beaker, then add N-methylpyrrolidone equivalent to 10 times the weight of melamine, stir rapidly with a glass rod and disperse ultrasonically for 5 minutes, and the obtained white paste Add it to solution A, and at the same time use mechanical stirring and ultrasonic dispersion to disperse melamine evenly in the resin to obtain solution B;
[...
Embodiment 3
[0052] In this embodiment, the low dielectric constant polyimide film material has the following structural formula:
[0053]
[0054] The specific preparation method is:
[0055] 1) Add 9.9g (0.05mol) 4,4'-diaminodiphenylmethane (MDA) in a three-necked flask and dissolve it in 60g N,N-dimethylformamide, then add 3,3',4, 4'-diphenyl ether tetracarboxylic dianhydride (ODPA) (the molar ratio of MDA and ODPA is 0.9:1), stirred at 35°C for 4 hours until completely dissolved to obtain a homogeneous solution A, the solid content of the solution was 30%.
[0056] 2) Add melamine equivalent to 0.5 times the weight of polyimide in the beaker, then add N,N-dimethylformamide equivalent to 8 times the weight of melamine, stir rapidly with a glass rod and disperse ultrasonically for 5 minutes, and the obtained Add the white paste to solution A, and at the same time use mechanical stirring and ultrasonic dispersion to disperse melamine evenly in the resin to obtain solution B;
[0057]...
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