Method for solidifying copper foil and base material of roll-type IC card circuit board

A curing method and circuit board technology, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of substrate wrinkles, layered deformation, and inability to achieve peel strength, etc., and achieve the effect of solving cumbersome processes and solving wrinkles

Inactive Publication Date: 2014-12-24
ZHANGZHOU FASTO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the falsely pasted substrate is directly cured as a whole roll, due to the inconsistent expansion coefficients of the base material, glue and copper foil, the cured substrate will appear wrinkled, delaminated and deformed, and cannot achieve the specified peel strength. manufacturing, resulting in high production costs

Method used

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  • Method for solidifying copper foil and base material of roll-type IC card circuit board
  • Method for solidifying copper foil and base material of roll-type IC card circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A method for curing the copper foil and base material of a roll-type IC card circuit board, comprising the following two steps:

[0014] 1) if figure 1 As shown, the roll-type substrate 1, bonding glue 2, and copper foil 3 are first bonded together by a roll-to-roll laminating device, so that it becomes a roll with copper foil 3 and glue 2 pre-fixed on the Uncured bulk substrate 4 on substrate 1;

[0015] 2) Curing the bonded whole roll of substrate 4 in three stages, the first stage is heated at 90°C for one hour to make the inside of the adhesive 2 flow evenly; then heated at 120°C for two hours to cure the substrate 4 at high temperature; finally Then heat at 160° C. for three hours to fully mature the bonding glue 2 and let it cool down naturally.

[0016] working principle:

[0017] Firstly, the rolled base material 1, bonding glue 2, and copper foil 3 are pasted together by a bonding device, and then the bonded whole roll of substrate is cured by a three-stage...

Embodiment 2

[0019] A method for curing the copper foil and base material of a roll-type IC card circuit board, comprising the following two steps:

[0020] 1) if figure 1 As shown, the roll-type substrate 1, bonding glue 2, and copper foil 3 are first bonded together by a roll-to-roll laminating device, so that it becomes a roll with copper foil 3 and glue 2 pre-fixed on the Uncured bulk substrate 4 on substrate 1;

[0021] 2) Curing the bonded whole roll of substrate 4 in three stages, the first stage is heated at 98°C for one hour to make the inside of the adhesive 2 flow evenly; then heated at 110°C for two hours to cure the substrate 4 at high temperature; finally Then heat at 164° C. for three hours to fully mature the bonding glue 2 and let it cool down naturally.

Embodiment 3

[0023] A method for curing the copper foil and base material of a roll-type IC card circuit board, comprising the following two steps:

[0024] 1) if figure 1 As shown, the roll-type substrate 1, bonding glue 2, and copper foil 3 are first bonded together by a roll-to-roll laminating device, so that it becomes a roll with copper foil 3 and glue 2 pre-fixed on the Uncured bulk substrate 4 on substrate 1;

[0025] 2) Curing the bonded whole roll of substrate 4 in three stages, the first stage is heated at 87°C for one hour to make the inside of the adhesive 2 flow evenly; then heated at 126°C for two hours to cure the substrate 4 at high temperature; finally Then heat at 152° C. for three hours to fully mature the bonding glue 2 and let it cool down naturally.

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Abstract

The invention discloses a method for solidifying copper foil and a base material of a roll-type IC card circuit board. The method includes the steps that the roll-type base material, bonding glue and the copper foil are bonded together through a roll-to-roll bonding device to form a whole unsolidified roll substrate provided with the copper foil and the glue which are fixed to the base material in advance, and then three-stage type solidifying is adopted for the bonded whole roll substrate. By means of the method for solidifying the copper foil and the base material of the roll-type IC card circuit board, heating solidifying is carried out on the substrate in a three-stage mode, the problem of the complex technology caused by sheet-type delivery is solved, the peel strength of the processed substrate reaches 1.4 N / mm which is larger than the industry index of 1.2 N / mm, and meanwhile the problems of cockling, layered deformation and the like of the solidified substrate in the traditional technology are solved.

Description

technical field [0001] The invention relates to a curing method, in particular to a method for curing the copper foil and base material of a rolled IC card circuit board. Background technique [0002] Traditional circuit boards are delivered in sheets, and the combination of the copper foil and the base material is completed by lamination and curing. The bonding must be done through roll-to-roll bonding, after high temperature and a certain curing time, in order to make the bond firm and achieve the specified peel strength. However, if the falsely pasted substrate is directly cured as a whole roll, due to the inconsistent expansion coefficients of the base material, glue and copper foil, the cured substrate will appear wrinkled, delaminated and deformed, and cannot achieve the specified peel strength. manufacturing, leading to high production costs. Contents of the invention [0003] In order to overcome the above-mentioned problems, the present invention provides a meth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 陈礼炉
Owner ZHANGZHOU FASTO ELECTRONICS
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