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111 results about "Roll bonding" patented technology

Roll bonding is a solid state, cold welding process, obtained through flat rolling of sheet metals. In roll bonding, two or more layers of different metals are passed through a pair of flat rollers under sufficient pressure to bond the layers. The pressure is high enough to deform the metals and reduce the combined thickness of the clad material. The mating surfaces must be previously prepared (scratched, cleaned, degreased) in order to increase their friction coefficient and remove any oxide layers. The process can be performed at room temperature or at warm conditions. In warm roll bonding, heat is applied to pre-heat the sheets just before rolling, in order to increase their ductility and improve the strength of the weld. The strength of the rolled bonds depends on the main process parameters, including the rolling conditions (entry temperature of the sheets, amount of thickness reduction, rolling speed, etc.), the pre-rolling treatment conditions (annealing temperature and time, surface preparation techniques, etc.) and the post-rolling heat treatments.

Method for preparing metal layered micro-gradient composite material

The invention discloses a method for preparing a metal layered micro-gradient composite material. The method is mainly characterized in that the micro-gradient composite material is obtained through interface diffusion of alloy elements with the homologous-series heterogeneous multi-layer metal rolling bonding and heat processing technology. Metal with two kinds of alloy content is adopted for rolling bonding, and the to-be-bonded surfaces are grinded and washed; after the ends are fixed, rolling bonding is carried out, and a multi-layer heterogeneous metal composite board is prepared; then heat processing is carried out on the composite board, the temperature is kept for a certain period of time according to requirements, the alloy elements are diffused on interfaces, and therefore the layered micro-gradient composite material is obtained. According to the metal layered micro-gradient composite material prepared with the method, obvious micro-gradients in chemical components and performance exist nearby the interfaces, and the good interface bonding strength can be achieved; the number of the micro-gradient interfaces and the thickness of micro-gradient layers can be adjusted and controlled by changing the rolling bonding technology, the laminating order and the heat processing technology.
Owner:CHONGQING UNIV

Preparation method of electromagnetic shielding multi-layer composite material in electric vacuum device

The invention relates to a preparation method of an electromagnetic shielding multi-layer composite material in an electric vacuum device, which belongs to the field of preparation of layered composite materials. The preparation process comprises the following steps: firstly performing large-deformation rolling bonding on oxygen-free copper after surface treatment and an electrical pure iron thin plate, and getting a Cu / Fe / Cu composite foil with higher parallelism and mechanical properties; and then combining and stacking the Cu / Fe / Cu foil with a molybdenum sheet and other low thermal expansion refractory metals, placing in a diffusion welding furnace to perform diffusion welding at a certain temperature and pressure, and further preparing the multi-layer composite material with good magnetic shielding effect, high dimensional precision, strong mechanical properties and good thermal matching. By adopting the new preparation process, not only the problem that the low thermal expansion metals are difficult to compound is solved, but also the advantages of rolling bonding and the diffusion welding process can be fully played, thereby realizing good parallelism among laminated layers, high dimensional precision and excellent mechanical properties of the material, simultaneously having relatively low cost and high production efficiency, and being easy to realize large-scale and industrialized production.
Owner:CENT SOUTH UNIV

Composite technique for rolling semi-solid state copper-lead bearing alloy/steel bi-metal

The invention relates to a roll-bonding process for semisolid copper-lead bearing alloys/steel bimetals. The weight content percentage of the lead in the copper-lead bearing alloy is 10.0 to 30.0%. In order to refine the crystalline grain of the lead and improve the mechanical property of the alloy, sulfur, tin, nickel, manganese, rare earth and other the third alloy elements can be added in the copper-lead alloy. The process comprises four steps: pretreatment of steel plates, preparation of semisolid sizing agent, roll bounding and water cooling. The detailed process comprises the following steps: performing mechanical agitation to the melted copper-lead bearing alloys at 930 to 1050 DEG C to obtain the semisolid sizing agent; pouring the semisolid sizing agent on the pretreated steel plates; synchronously feeding the semisolid copper-lead bearing alloys and solid steel plates in to a mill for rolling; spraying water for cooling to obtain the bimetallic composite plate. The invention effectively overcomes the defect of lead segregation in the production of the copper-lead bearing alloys in the prior art, therefore, metallographic structure with fine lead particle and even distribution is obtained. According to mechanical test results, the interfacial shear strength of the copper-lead bearing alloys/steel bimetallic slabs prepared using the process is more than 60Mpa, increased by about 10Mpa.
Owner:UNIV OF SCI & TECH BEIJING

Dissimilar metal rolling bonding method with embedded type rib and groove interlocking

The invention discloses a dissimilar metal rolling bonding method with embedded type rib groove interlocking, and belongs to the field of bi-metal composite plate preparing. The method comprises the following steps of S1, single-side convex rib rolling, wherein a flat roller and a figure roller with a groove are matched, a first plate blank is rolled, and a convex rib is formed on the single sidesurface of the first plate blank; S2, preassembling rolling, wherein a second plate blank and the first plate blank are embedded, the first plate blank is embedded into the second plate blank to formchain type connection, and an embedded composite workpiece is formed; and S3, asymmetrical rolling, wherein the embedded composite workpiece is subjected to asymmetrical forming rolling, and a dissimilar metal composite plate is formed. The problem that in the prior art, the bonding strength of a dual-metal composite plate is low totally can be solved, the rolling bonding method that embedded typeribs and grooves are manufactured in dissimilar metal contact, and through asymmetrical rolling, rib and groove interlocking is achieved is adopted, measures of combining mechanical type connection,generation of an interlocking structure and increasing the diffusion rate are used, and the interface contact strength can be sufficiently improved.
Owner:ANHUI UNIVERSITY OF TECHNOLOGY

Package based on technology that frame is connected through bonding wires and manufacturing process of package

The invention discloses a package based on the technology that a frame is connected through bonding wires and a manufacturing process of the package. The package comprises a chip, a plastic packaging body, a silver-plated layer and the bonding wires. The silver-plated layer is composed of silver-plated layer sections which are independent from each other, the chip is located on a part of the silver-plated layer, the chip is connected with the portions, without the chip, of the silver-plated layer through the bonding wires, the plastic packaging body wraps the chip, the silver-plated layer and the bonding wires, and the chip, the silver-plated layer and the bonding wires constitute a power source and signal channel of a circuit. The package further comprises metal bumps. The manufacturing process comprises silver plating of the frame, wafer thinning, scribing, assembly of the chip, manufacturing of the metal bumps, pressure welding, plastic packaging, corrosion of the frame, cutting and packing, wherein the step of manufacturing of the metal bumps can be eliminated. According to the package and the manufacturing process thereof, due to the fact that pressure welding is directly conducted on the metal bumps after electrosilvering or the method of direct wiring after electrosilvering is used, design of a frame graph is finished when the frame is manufactured, the manufacturing period is shortened, interconnection of the chip and carriers is achieved better, the higher I/O density is achieved, and cost is lower.
Owner:CHINA CHIPPACKING TECH

Method for manufacturing conductive metal connecting piece connected with PCB and connecting piece

The invention provides a method for manufacturing a conductive metal connecting piece connected with a PCB and the connecting piece manufactured by adopting the method. The method comprises the following steps: an embedding layer is embedded in a groove of a metal substrate provided with the groove and roll bonding is conducted at the embedding position so that a composite metal strip can be formed, wherein the metal substrate is made of copper or stainless steel, and the embedding layer is a copper layer or a silver layer or a copper-silver composite layer with silver on the surface; the composite metal strip after rolling is subjected to softening annealing and rolling for at least two times, wherein the rolling deformation rate between the two times of softening annealing is not lager than 60%; the composite metal strip with a required specification and thickness is stamped so as to from the conductive metal connecting piece. The method for manufacturing the conductive metal connecting piece has the advantages that the processes are environmentally friendly, the manufactured conductive metal connecting piece is high in electrical conductivity, the combination stability between the conductive metal connecting piece and the PCB is high, and the formability is good.
Owner:SHENZHEN NONFEMET TECH
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