The invention discloses a package based on the technology that a frame is connected through bonding wires and a manufacturing process of the package. The package comprises a chip, a plastic packaging body, a silver-plated layer and the bonding wires. The silver-plated layer is composed of silver-plated layer sections which are independent from each other, the chip is located on a part of the silver-plated layer, the chip is connected with the portions, without the chip, of the silver-plated layer through the bonding wires, the plastic packaging body wraps the chip, the silver-plated layer and the bonding wires, and the chip, the silver-plated layer and the bonding wires constitute a power source and signal channel of a circuit. The package further comprises metal bumps. The manufacturing process comprises silver plating of the frame, wafer thinning, scribing, assembly of the chip, manufacturing of the metal bumps, pressure welding, plastic packaging, corrosion of the frame, cutting and packing, wherein the step of manufacturing of the metal bumps can be eliminated. According to the package and the manufacturing process thereof, due to the fact that pressure welding is directly conducted on the metal bumps after electrosilvering or the method of direct wiring after electrosilvering is used, design of a frame graph is finished when the frame is manufactured, the manufacturing period is shortened, interconnection of the chip and carriers is achieved better, the higher I/O density is achieved, and cost is lower.