Package based on technology that frame is connected through bonding wires and manufacturing process of package

Abstract

The invention discloses a package based on the technology that a frame is connected through bonding wires and a manufacturing process of the package. The package comprises a chip, a plastic packaging body, a silver-plated layer and the bonding wires. The silver-plated layer is composed of silver-plated layer sections which are independent from each other, the chip is located on a part of the silver-plated layer, the chip is connected with the portions, without the chip, of the silver-plated layer through the bonding wires, the plastic packaging body wraps the chip, the silver-plated layer and the bonding wires, and the chip, the silver-plated layer and the bonding wires constitute a power source and signal channel of a circuit. The package further comprises metal bumps. The manufacturing process comprises silver plating of the frame, wafer thinning, scribing, assembly of the chip, manufacturing of the metal bumps, pressure welding, plastic packaging, corrosion of the frame, cutting and packing, wherein the step of manufacturing of the metal bumps can be eliminated. According to the package and the manufacturing process thereof, due to the fact that pressure welding is directly conducted on the metal bumps after electrosilvering or the method of direct wiring after electrosilvering is used, design of a frame graph is finished when the frame is manufactured, the manufacturing period is shortened, interconnection of the chip and carriers is achieved better, the higher I/O density is achieved, and cost is lower.

Description

[0001] technical field [0002] The invention belongs to the technical field of integrated circuit packaging, in particular to a frame-based package using bonding wire connection technology and a manufacturing process thereof. Background technique [0003] Integrated circuit flat no-lead packaging has been developed in recent years with the emergence of communication and portable small digital electronic products (digital cameras, mobile phones, PCs, MP3), suitable for high frequency, broadband, low noise, high thermal conductivity Packaging of small and medium-sized integrated circuits with electrical requirements such as small volume and high speed. The integrated circuit flat leadless package effectively utilizes the packaging space of the lead pins, thereby greatly improving the packaging efficiency. The package can reduce the volume of the CPU by 30%-50% due to the short leads, small size of the plastic package, and thin package. So it can provide excellent electrical...

AI Technical Summary

Problems solved by technology

[0004] Ordinary integrated circuit flat no lead package packaging mainly has the following disadvantages: the integrated circuit flat no lead package product of the frame carrier needs to design the frame pattern according to the chip size and circuit connection, and then process the frame into the designed pattern by corrosion and other methods , the design and production cycle is long, and the cost is relatively high

Moreover, the arrangement of bumps and the density of I / O in the current integrated circuit flat no-lead package series are also limited by the frame design and frame manufacturing process.

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