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A kind of flexible circuit board surface flatness technology for notebook computer

A technology for flexible circuit boards and board surface flatness, which is applied in the direction of secondary processing of printed circuits, etc., can solve the problems of high warpage of flexible circuit boards, and achieve the effect of high board surface flatness.

Active Publication Date: 2018-01-23
昆山圆裕电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a flatness process of the screen surface of the flexible circuit board for notebook computers, which solves the problem of excessive warpage of the flexible circuit board in the existing molding process

Method used

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  • A kind of flexible circuit board surface flatness technology for notebook computer

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with specific embodiments.

[0021] see figure 1 , the flatness process method of the flexible circuit board used in the notebook computer of the present invention comprises an oven (not shown), comprising the following steps: (1) preparatory work: prepare the flexible circuit board for flattening 1, check whether the oven is suitable for safe use Rules, some white paper 2 (flame retardant), two burnt iron plates 3; (2) pre-baking: put the flexible circuit board 1 to be baked upright in the oven shelf, turn on the power of the oven, set the drying The temperature is 100°C, and the time is 30 minutes. After the baking is completed, the flexible circuit board 1 is pulled out of the oven; (3) Secondary baking: perform secondary baking on the prebaked flexible circuit board 1 . Such as figure 1 As shown, during secondary baking, each flexible circuit board 1 is sandwiched between two white papers 2, the...

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PUM

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Abstract

The invention discloses a surface flatness process of a flexible circuit board for a notebook computer, which comprises the following steps: (1) Preparatory work: preparing a flexible circuit board for flattening, checking whether the oven complies with safe use rules, and several white papers (flame retardant), two burnt iron plates; (2) pre-baking: put the flexible circuit board to be baked upright in the oven shelf; (3) secondary baking: for the pre-baked The flexible circuit board is baked for the second time; (4) Inspection after baking: check the flexible circuit board that has completed the above process to see whether its flatness meets the process requirements. In the present invention, the flexible circuit board is baked twice, and the gravity of the burnt iron plate is used to tighten the flexible circuit board. Through the high temperature baking effect of the oven, the surface of the flexible circuit board is high in flatness, and the final board warpage is less than 6mm. .

Description

【Technical field】 [0001] The invention belongs to the technical field of flexible circuit board production, and more specifically relates to a surface flatness process of a flexible circuit board for notebook computers. 【Background technique】 [0002] As the requirements for the uniformity of keyboard lighting are getting higher and higher, the requirements for the flatness of the flexible circuit board surface are also getting higher and higher. From the production process of flexible circuit boards, the process that affects the flatness of flexible circuit boards is the baking of white photosensitive ink. When the white photosensitive ink is baked, the stress generated by the curing of the ink will cause the flexible circuit board to warp. The other method is to replace the white photosensitive ink with a white cover film, but because the cost of the white cover film is high and the process tolerance (±0.1mm) is larger than that of the white photosensitive ink (±0.03mm), ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22
Inventor 江培银张子云廖伟
Owner 昆山圆裕电子科技有限公司