Motor controller
A motor controller and housing technology, applied in the direction of cooling/ventilation/heating transformation, can solve the problems of unevenness, increased heat dissipation, large distributed inductance, etc., to expand the heat dissipation area, reduce the risk of false returns, and improve The effect of job stability
Inactive Publication Date: 2015-01-14
JIANGSU JINFENG ELECTROMECHANICAL CO
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Problems solved by technology
The copper resistance between the C phase of the controller and the power supply is longer than the other two phases, and the distributed inductance is large. Compared with the other two phases, the electrical stability of C is poor, resulting in temperature rise and high failure rate. The high temperature is too concentrated, and the heat dissipation of the product is conducted through the internal air flow of the product and the aluminum strip as a medium. This heat dissipation method increases the space of the product and makes the heat dissipation of the product slow and uneven. In order to ensure the temperature of the power device when the current is too large Due to the problem of instantaneous heat dissipation, the overall size of the controller is relatively large, which is not conducive to installation in a relatively narrow space
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[0035] Such as figure 1 , 2 , 3, the present invention is provided with a PCBA substrate 3 in the shell consisting of the upper case 1 and the lower cover 5, and the outer ring of the upper case 1 and the lower cover 5 is provided with a groove for placing a waterproof and waterproof seal Pad 6, in order to achieve the effect of peripheral sealing.
[0036] On the PCBA substrate 3, two rows of power devices 2 are symmetrically arranged along its length direction, and each row of power devices (such as MOS tubes) 2 is eight respectively, and each power device 2 is bent at 90 degrees and fixed on the PCBA substrate 3 superior.
[0037] Several elastic pads 4 are arranged between the lower cover 5 and the PCBA substrate 3 connected to the power device 2 , and each elastic pad 4 is connected to the PCBA substrate 3 and pressed tightly on the lower cover 5 .
[0038] Such as image 3 As shown, a set of phase line connectors 7 and a standard interface 10 of a thimble controller ...
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The invention relates to a motor controller and relates to the technical field of the production of motor controllers. A plurality of power devices, phase line connectors and signal plug-ins are arranged on a PCBA substrate in a controller shell, a first set of through holes corresponding to the phase line connectors and a second set of through holes corresponding to the signal plug-ins are formed in the controller shell, and ring-shaped sealing rings are arranged in the controller shell. According to the motor controller, the power devices are divided into two rows and are symmetrically arranged on the PCBA substrate, three-phase imbalance caused by arranging the power devise in a linear mode in the traditional design is reduced, the wiring length of the power devices is half of the length of the power devices in the traditional design, and thus three phases are more balanced and are more stable through the design. By means of the arrangement mode of the power devices, the size of products is reduced, the radiating area of the products is enlarged, thermal convection is directly formed after large current passes through the power devices, and the working stability of the products can be effectively improved.
Description
technical field [0001] The invention relates to the technical field of production of motor controllers. Background technique [0002] The power devices in the existing motor controller are arranged in a straight line, and each power device is locked on the long aluminum strip with screws, and then the long aluminum strips are fixed on the shell with screws. The copper resistance between the C phase of the controller and the power supply is longer than the other two phases, and the distributed inductance is large. Compared with the other two phases, the electrical stability of C is poor, resulting in temperature rise and high failure rate. The high temperature is too concentrated, and the heat dissipation of the product is conducted through the internal air flow of the product and the aluminum strip as a medium. This heat dissipation method increases the space of the product and makes the heat dissipation of the product slow and uneven. In order to ensure the temperature of t...
Claims
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IPC IPC(8): H05K7/20
Inventor 李明
Owner JIANGSU JINFENG ELECTROMECHANICAL CO