Release film, compression molding method, and compression molding apparatus

A technology of compression molding and release film, which is applied in the direction of chemical instruments and methods, lamination, lamination devices, etc., can solve the problems of difficult release film, low strength, and insufficient detachability of molded products, and achieve good Effects of efficiency, good processability, and good detachability

Inactive Publication Date: 2015-01-14
DOW CORNING TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, polytetrafluoroethylene resin (PTFE) films and ethylene-tetrafluoroethylene copolymer resin (ETFE) films have a problem in that although they have good releasability of molded products, they have low strength and are difficult as release films. Processing at molding temperature
Another problem is that there are difficulties in waste disposal and recycling of used polytetrafluoroethylene resin (PTFE) film and ethylene-tetrafluoroethylene copolymer resin (ETFE) film
[0005] On the other hand, although polyethylene terephthalate (PET) films and polypropylene resin (PP) films have good processability and are easy to dispose of after use, there is a problem in the availability of molded products. Not enough detachment

Method used

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  • Release film, compression molding method, and compression molding apparatus
  • Release film, compression molding method, and compression molding apparatus
  • Release film, compression molding method, and compression molding apparatus

Examples

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example

[0056] The release film, compression molding method, and compression molding apparatus of the present invention will now be described in detail with reference to practical examples. Note that the viscosity in the practical examples is a value at 25°C.

[0057] [Practical example 1]

[0058] An addition reaction curable silicone composition was prepared by mixing 100 parts by mass of dimethylsiloxane terminated with trimethylsiloxy groups at both molecular ends and a raw material of methylhexenylsiloxane. Rubber-like copolymer (hexenyl group content: 0.5% by weight), 2 parts by mass of methylhydrogenpolysiloxane having a viscosity of 150 mPa·s, chloroplatinic acid, and 1,3-divinyltetramethyldisiloxane A complex of alkanes (in an amount such that the amount of platinum metal is 200 ppm), 1 part by mass of 3-methyl-1-butyn-3-ol, and 1,957 parts by mass of toluene.

[0059] A PET film having a silicone-based cured product layer with a thickness of 4 μm was prepared by coating ...

reference example 1

[0070] [Reference Example 1] (Preparation of silicone-modified epoxy resin molding material)

[0071] By uniformly mixing 5.96 g of an epoxy-modified silicone resin (epoxy equivalent: 299; viscosity: 13.4 Pa·s; mass average molecular weight: 2,600) represented by the following average unit formula,

[0072] Formula 1

[0073]

[0074] 6.04 g 3,4-epoxycyclohexenylmethyl-3',4'-epoxycyclohexenecarboxylate (Celoxide 2021P, manufactured by Daicel Chemical Industries Ltd.) ), 11.16g of 3- or 4-methyl-hexahydrophthalic anhydride (HN 5500E, manufactured by Hitachi Chemical Co., Ltd.), and 0.194g of methyl tributyl dimethylphosphonate A transparent silicone-modified Epoxy molding compound.

reference example 2

[0075] [Reference Example 2] (Preparation of epoxy resin molding material)

[0076] By uniformly mixing 10.07 g of 3,4-epoxycyclohexenylmethyl-3',4'-epoxycyclohexene carboxylate (Celoxide 2021P, manufactured by Daicel Chemical Industries, Ltd.), 12.93 g 3- or 4-methyl-hexahydrophthalic anhydride (HN 5500E, manufactured by Hitachi Chemical Co., Ltd.) and 0.188 g of methyltributylphosphonium dimethylphosphonate (Hishicolin PX-4MP, manufactured by Nippon Chemical A transparent epoxy resin molding material was prepared from a curable epoxy resin composition obtained by Industrial Co., Ltd.

[0077] [Practical example 5]

[0078] As a compression molding machine, FFT1005 manufactured by Towa Co., Ltd. consisting of a top mold and a bottom mold having a cavity in the bottom mold and a release film feeding mechanism on the side of the bottom mold was used. Set the glass epoxy substrate on the top mold of the compression molding machine. The mold of the bottom mold has 100 cavi...

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Abstract

The present invention relates to a release film used by being interposed between a molding material and a mold when the molding material is compression molded using the mold in order to form a sealing material or reflective frame material for an optical semiconductor element, or a lens, wherein the release film comprises a silicone-based cured product layer (2) on at least a surface in contact with the molding material; as well as a compression molding method that uses the film; and a compression molding apparatus that uses the film. The release film for the compression molding of molding materials has good workability and has good releasability, and thereby, a compression molding method with which compression molding with good efficiency is possible and a compression molding apparatus with which molding with good efficiency is possible.

Description

technical field [0001] The present invention relates to a release film, a compression molding method using the film, and a compression molding apparatus using the film. [0002] Priority is claimed to Japanese Patent Application No. 2012-104071 filed Apr. 27, 2012, the contents of which are incorporated herein by reference. Background technique [0003] A method of molding a sealing material for an optical semiconductor element, or a method of molding a reflective frame for an optical semiconductor element, and a method of molding a lens by compression molding the molding material using a mold are known. well known (refer to Japanese Unexamined Patent Application Publication Nos. 2005-305954, 2006-093354, 2006-148147 and 2008-227119). These methods use a release film because the releasability of the molded product from the mold is improved and burrs can be reduced. Fluorine resin films such as polytetrafluoroethylene resin (PTFE) film, ethylene-tetrafluoroethylene copolyme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C33/68B29C43/18B29C43/50H01L21/56B32B37/26B32B27/28
CPCH01L24/97B32B2037/268B29C33/68H01L2224/48091H01L2224/97H01L21/566H01L2924/12041B29C43/021B29C43/18H01L2924/181H01L2924/12042Y10T428/31507Y10T428/31663Y10T428/268B29K2883/005H01L2924/00014H01L2224/85H01L2924/00B29C43/50
Inventor 森田好次吉田真宗远藤修司
Owner DOW CORNING TORAY CO LTD
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