Heat conduction and radiation device

Abstract

The invention discloses a heat conduction and radiation device. The heat conduction and radiation device comprises a graphite base, a heat conduction copper pipe and a film, wherein the graphite base is a sheet-like structure, the heat conduction copper pipe is a flat structure, one face of the graphite base is pasted with the film, the other face of the graphite base is pasted with one face and two side faces of the heat conduction copper pipe, and width of the graphite base is greater than width of the heat conduction copper pipe. The heat conduction copper pipe is designed to be the flat structure, so the use scope is wider; one face of the sheet-like graphite base is pasted with one face and two side faces of the heat conduction copper pipe, through combination of the two, heat conduction and radiation performance is not only improved, heat can be reduced to a lower level more rapidly, but also temperature difference of the two ends and the two sides can be effectively reduced, the temperature is more uniform, and damage to elements of products is prevented; as the width of the graphite base is greater than the width of the heat conduction copper pipe, the other face of the graphite base is pasted with the film, so the insulation effect is realized, and great convenience is realized for enterprises or users.

Description

technical field [0001] The invention relates to the application field of heat conduction and heat dissipation devices, in particular to a heat conduction and heat dissipation device using graphite. Background technique [0002] In recent years, with the continuous development of electronic technology, especially the continuous upgrading of smart phones, notebook computers, tablet computers and large servers, the size of its working components is getting smaller and smaller, and the working speed and efficiency are getting higher and higher. Its calorific value is also increasing, so a reasonable and effective solution to the heat conduction and heat dissipation of the above products has always been a difficult problem in the industry. [0003] In the traditional process, heat conduction copper tubes are usually used to realize heat conduction and heat dissipation, and the mutual conversion of liquid and gas states of the coolant in the copper tubes is used to effectively dis...

AI Technical Summary

Problems solved by technology

In modern technology, graphite heat sink is usually used as the first choice material for heat conduction and heat dissipation. Graphite heat sink can conduct heat in horizontal and vertical directions, and its size can be large or small, and its lamellar structure can better make it suitable for any On the surface of the product, although the heat conduction and heat dissipation speed of the graphite heat sink is relatively fast, its temperature uniformity is not very ideal. Cause damage, which may lead to the scrapping of components in serious cases, and bring unnecessary economic losses and troubles to enterprises or users; because heat-conducting copper tubes and graphite heat sinks are conductive, and some components inside the above products need insulation, Therefore, the use of heat-conducting copper tubes and graphite heat sinks alone cannot achieve the effect of insulation

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