Coating film clamping device for coating film substrate
A technology for clamping device and substrate, applied in sputtering plating, ion implantation plating, vacuum evaporation plating, etc., can solve problems such as troublesome, easy to change the inner size of substrate, etc., achieve high degree of automation and save labor , the effect of easy installation
Inactive Publication Date: 2015-01-28
董新妹
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Problems solved by technology
However, this grinding method is both troublesome and easy to change the inner size of the substrate.
Method used
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[0019] The technical solutions of the embodiments of the present invention will be explained and described below in conjunction with the drawings of the embodiments of the present invention, but the following embodiments are only preferred embodiments of the present invention, not all of them. Based on the examples in the implementation manners, other examples obtained by those skilled in the art without making creative efforts all belong to the protection scope of the present invention.
[0020] refer to figure 1 , figure 2 with image 3 , the coating clamping device of a kind of coated film substrate shown, comprises lower splint 1, lifting plate 3, is positioned at the upper splint 2 between lower splint 1 and lifting plate 3, is connected with lifting drive device on the lifting plate 3, coating The clamping device also includes a rotating drive device that drives the lifting plate 3 and the upper clamping plate 2 to rotate and separate or to rotate and overlap with res...
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The invention discloses a coating film clamping device for a coating film substrate, relates to the field of coating films and aims at solving the technical problems that a coating film clamping device is single in function and low in mechanical degree in the prior art. The coating film clamping device for the coating film substrate comprises a lower clamping plate, a lifting plate and an upper clamping plate arranged between the lower clamping plate and the lifting plate, wherein the lifting plate is connected with a lifting driving device, the coating film clamping device for the coating film substrate also comprises a rotation driving device which is used for driving the lifting plate and the upper clamping plate to rotate relative to the lower clamping plate so as to be separated from or coincided with the lower clamping plate, a mounting hole is formed in the lower clamping plate, a positioning step is formed on the mounting hole, the substrate is compacted between the upper clamping plate and the positioning step when the upper clamping plate and the lower clamping plate coincide, a connecting hole opposite to the mounting hole is formed in the upper clamping plate, a protective cap connected with the lifting plate is connected into the connecting hole in a penetrating manner, the protective cap comprises a hollow supporting column, an expansion sleeve is arranged at the bottom of the supporting column, and the top of the supporting column is connected with a gas injecting pipe. The coating film clamping device for the coating film substrate is applied to coating film processing of the substrate.
Description
【Technical field】 [0001] The invention relates to the coating field, in particular to a substrate clamping device. 【Background technique】 [0002] At present, Physical Vapor Deposition (PVD for short) is the most widely used thin film manufacturing method, which is widely used in many fields such as ceramics and optics, and is used to form metal electrodes and the like. The method is to heat the raw material to be formed in the evaporation container in a vacuum chamber, make its atoms or molecules gasify and escape from the surface, form a vapor flow, and condense to form a solid film after reaching the surface of the substrate (or substrate). method. When coating, it is generally necessary to use a fixture to hold the substrate. At the same time, since the steam is scattered in the air, the fixture should also have a protective function in order to prevent some places on the substrate where electrodes should not be formed, such as the side, from being evaporated. [0003...
Claims
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IPC IPC(8): C23C14/50C23C14/24
CPCC23C14/50C23C14/24
Inventor 董新妹
Owner 董新妹