Unlock instant, AI-driven research and patent intelligence for your innovation.

Design method of PCB (printed circuit board) controllable impedance through holes

A design method and PCB board technology, applied in the direction of electrical connection of printed components, printed circuit components, etc., can solve the problems of discontinuous transmission line impedance, signal jitter, affecting signal quality, etc., and achieve the effect of improving signal integrity

Inactive Publication Date: 2015-02-25
INSPUR GROUP CO LTD
View PDF6 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As data transmission rates increase, signal integrity is critical for smooth data transmission, and every impedance mismatch on a high-speed signal path may generate signal jitter that affects signal quality
As the signal density on the PCB increases, more signal transmission layers are required, and it is inevitable to achieve transmission through interlayer interconnections. These vias will cause discontinuity in the transmission line impedance and will vary according to the data rate. A lot of jitter is generated, so we need to find a way to control the impedance of the via to ensure the continuity of the impedance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Design method of PCB (printed circuit board) controllable impedance through holes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0007] The method of the present invention is described in detail below with reference to the accompanying drawings.

[0008] A through-hole design method with controllable PCB impedance, the specific steps are as follows:

[0009] The present invention utilizes a new coaxial-like through-hole structure. In this structure, the ground vias are arranged around the center signal vias in a special configuration, and the ground vias are grounded and shielded around the center signal vias. An evenly distributed impedance, four ground vias arranged in a circle around the central signal via ground replaces the traditional uniform ground shielding approach. Capacitance is formed between each ground via hole and the signal via hole, and the calculation of capacitance depends on the diameter of the central signal via hole, the dielectric constant, and the distance between the signal via hole and the ground via hole. The ground vias around the central signal via provide a return path for...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a design method of PCB (printed circuit board) controllable impedance through holes. A PCB is provided with a central signal through hole; ground through holes are arranged around the central signal through hole; the ground through holes function in shielding thus a uniformly distributed impedance is generated; the four ground through holes are arranged around the central signal through hole in a circle replacing a traditional uniformly-distributed shield; capacitance is generated between each ground through hole and the central signal through hole; the calculation of the capacitances is determined by the diameter and dielectric constant of the central signal through hole and distances between the central signal through hole and the ground through holes; the ground through holes around the central signal through hole provide a reflow path for signals; an inductance loop is generated between the central signal through holes and the ground through holes; an adjustable impedance vertical channel is accordingly generated; moderate parameters are calculated and selected, thus allowing transmission line impedance continuity and signal completeness.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a through hole design method with controllable PCB impedance. Background technique [0002] As data transmission rates increase, signal integrity is critical for smooth data transmission, and every impedance mismatch on a high-speed signal path may generate signal jitter that affects signal quality. Due to the increase of signal density on the PCB, more signal transmission layers are required, and it is inevitable to achieve transmission through interlayer interconnections. These vias will cause discontinuity in the transmission line impedance and will vary according to the data rate. A lot of jitter is generated, therefore, we need to find a way to control the impedance of the via to ensure the continuity of the impedance. Contents of the invention [0003] The purpose of the present invention is to provide a PCB impedance controllable through-hole design ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11
Inventor 柯华英关盈崔铭航
Owner INSPUR GROUP CO LTD