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Pressing device for laser packaging device, laser packaging device and packaging and pressing method

A pressure device and laser encapsulation technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of organic light-emitting diode display device components being squeezed, not easy to control the force, and time-consuming.

Active Publication Date: 2015-03-04
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The third step of the current packaging method is only to temporarily protect the device and make the glass frit contact the first substrate, but due to vacuum pressing, it will cause extrusion damage to the OLED display device.
And this step requires the use of gluing equipment and pressing equipment for pressing, which takes a long time and has high production costs
[0004] In addition, a fluid beam is used to apply air pressure to the bonded substrates so that the first substrate and the glass frit are bonded together and sintered with a laser. Here, a high-pressure inert gas is required to apply pressure (high cost and difficult to control the strength). And need to consider cavity pressure tolerance

Method used

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  • Pressing device for laser packaging device, laser packaging device and packaging and pressing method
  • Pressing device for laser packaging device, laser packaging device and packaging and pressing method
  • Pressing device for laser packaging device, laser packaging device and packaging and pressing method

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Effect test

Embodiment 1

[0043] Such as figure 1 , figure 2 and image 3 as shown, figure 1 The structure of the pressure applicator employing two pressure adjustment rods is shown. figure 2 A diagram showing its working effect, image 3 A top view of the pressure-applying wheel when applying pressure is shown.

[0044] Specifically, there are two pressure regulating rods 12 in the pressure applying device 10 provided in this embodiment, and the line connecting the installation positions of the two pressure regulating rods 12 passes through the center of the through hole 111 .

[0045] In specific use, the two pressure regulating rods 12 are located on the sealant 40, the through hole 111 on the support seat 11 is located between the two pressure regulating rods 12, and the three are located on the same straight line. Between the sealants 40, firstly adjust the length of the pressure adjustment rod 12, so that the pressing wheel 13 can provide proper pressure to squeeze the two substrates, so tha...

Embodiment 2

[0047] Such as Figure 4 , Figure 5 and Image 6 as shown, image 3 shows a configuration employing four pressure adjustment rods, Figure 4 A diagram showing its working effect, Image 6 A top view of a pressure wheel in operation is disclosed. Specifically, the number of pressure adjusting rods 12 of the pressure applying device 10 provided in this embodiment is four, and the four pressure adjusting rods 12 are arranged around the through hole 111 .

[0048] Compared with the first embodiment, the pressure applying device 10 provided in this embodiment has two pressure adjustment rods 12 added. Moreover, four pressure adjusting rods 12 are arranged around the through hole 111 , thereby further ensuring that the pressure provided by the pressing wheel 13 can ensure the tight combination between the two substrates and the sealant 40 .

[0049] continue to refer image 3 The intersection of the cross-connection lines of the four pressure adjustment rods 12 provided in t...

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PUM

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Abstract

The invention relates to the manufacturing technology field of display devices, and discloses a pressing device for a laser packaging device, a laser packaging device and a packaging and pressing method. The pressing device comprises a supporting seat, a through hole arranged on the supporting seat for enabling a laser beam to penetrate through and at least one pressure adjusting rod arranged on the supporting seat in a sliding mode, wherein one end, far away from the supporting seat, of each pressure adjusting rod is provided with a pressing wheel. In the above technical scheme, two substrates are squeezed and attached via the pressing wheel so as to ensure frame packaging adhesives on the first substrate and the second substrate to be contacted, and in the case of laser sintering, the first substrate and the second substrate are sintered together via the frame packaging adhesives. Meanwhile, as physical pressing of the pressing wheel is adopted, the former frame packaging adhesive pressing procedure can be omitted, procedures can be reduced, and the production cost is shortened. In addition, the pressing area of the pressing wheel is only limited to partial laser sintering area, and influences on an organic light emitting diode display device are few.

Description

technical field [0001] The invention relates to the technical field of manufacturing display devices, in particular to a pressure applying device for a laser packaging device, a laser packaging device and a sealing and pressing method. Background technique [0002] At present, the packaging method of glass frit is as follows: step 1: printing glass frit on the second substrate, step 2: baking the printed second substrate; step 3: making the first substrate and the second substrate Substrate lamination; Step 4: laser sintering and lamination of the first substrate and the second substrate. [0003] The third step of the current encapsulation method is only to temporarily protect the device and make the glass frit contact the first substrate, but due to the vacuum pressing, it will cause extrusion damage to the OLED display device. And this step needs to use gluing equipment and pressing equipment for pressing, which takes a long time and has high production costs. [0004] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L21/67
CPCH01L21/67126H10K71/00
Inventor 王伟
Owner BOE TECH GRP CO LTD