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Carbon fiber composite material thick laminated structure uniform glue absorption method and laminated structure

A composite material layer, laminate structure technology, applied in chemical instruments and methods, lamination, lamination devices, etc., can solve the problem of uneven glue absorption of thick laminates, and achieve improved mechanical properties, fewer defects, and resin distribution. uniform effect

Active Publication Date: 2016-04-13
HENGSHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of uneven glue absorption of thick laminated boards along the thickness direction, the technical solution of the present invention is:

Method used

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  • Carbon fiber composite material thick laminated structure uniform glue absorption method and laminated structure
  • Carbon fiber composite material thick laminated structure uniform glue absorption method and laminated structure
  • Carbon fiber composite material thick laminated structure uniform glue absorption method and laminated structure

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Embodiment

[0039] The embodiment is a kind of prepreg with glass fiber cloth or carbon fiber dry gauze or lower resin content when the laminate 02 is laid to a certain thickness during the process of laying up the composite laminate structure with prepreg material, so that the laminated board 02 can obtain a structure that absorbs glue uniformly along the thickness direction after curing. It is suitable for 02 curing of laminates with large thickness and high resin content. This method is not applicable to the zero-adhesive process or lay-up with zero-adhesive prepreg.

[0040] Embodiments can avoid the occurrence of figure 2 A resin content gradient appears between the top 02a and the bottom 02b, so that the resin content of the laminate 02 in the thickness direction is uniform, so as to improve its mechanical properties.

[0041] In order to solve the problem of uneven glue absorption of thick laminated boards, the embodiment is as follows image 3 Lay the method shown, that is, af...

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Abstract

The invention provides a method for enabling a carbon fiber composite thick laminated structure to uniformly absorb resin and a laminated structure. The method comprises the following steps: alternately laying prepreg layers and resin absorbing layers on the surface of a mould till a required thickness design value, and enabling the peripheries of the resin absorbing layers to go beyond a main body prepreg laminated plate; arranging a baffling strip as high as the laminated plate around the laminated plate, connecting the resin absorbing layers by using a breathable material, and enabling the breathable material to penetrate through the baffling strip to allow the resin absorbing layers to be communicated with an external air pumping system; laying auxiliary materials on the laminated plate sequentially, tightly sealing a vacuum bag by using sealing adhesive, and putting a whole system into a hot pressing tank for curing so as to obtain a laminated plate structure with uniformly distributed resin. Through the adoption of the method, the problem that resin cannot be uniformly absorbed in the thickness direction in the curing process of the prepreg laminated plate with the thickness being larger than 5mm is solved; the resin is uniformly distributed inside the obtained thick laminated plate; the thick laminated plate has small defects; fatigue resistance, impact toughness and other mechanical properties of the thick laminated plate are greatly improved.

Description

technical field [0001] The invention relates to a method for uniform glue absorption of a thick laminated structure of carbon fiber composite materials and a laminated structure, which belongs to the field of composite material forming and is suitable for manual laying or automatic laying to form a composite material laminated plate structure of a certain thickness. Background technique [0002] The usual process of forming a composite material structure with prepreg is: laying the prepreg directly to the desired thickness of the laminate (during which there may be a pre-pumping process if necessary), sealing the bag and putting the laminate into an oven or autoclave , solidified under certain temperature, pressure and time. [0003] When the laminate structure is thick and the prepreg system used has a large amount of glue flow during the curing process, the layer away from the mold surface is close to the absorbing material, resulting in more glue flow; the layer near the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B37/10B32B9/04B32B17/04B29C70/34B29C70/44
CPCB29C70/342B29C70/44B32B9/04B32B17/04B32B37/06B32B37/10B32B2307/552B32B2307/558
Inventor 方宜武王岩洁吴维维郑晓谦李莹莹夏斯将
Owner HENGSHEN
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