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Non-contact wafer transfer equipment

A non-contact, transfer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as wafer distortion, chipping, etc., to ensure accuracy and efficiency.

Pending Publication Date: 2021-11-09
苏州桓旭半导体科技有限公司
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Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the object of the present invention is to provide a non-contact wafer transfer equipment, which can realize the non-contact firm grasping of the wafer by using the Bernoulli principle, which solves the traditional manual Handling and ordinary negative pressure vacuum suction handling methods may cause wafer distortion or chipping

Method used

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Embodiment 1

[0036] see Figure 1-10 , a non-contact wafer transfer equipment, including a transfer bracket 1, a suction mechanism 2 is installed on one side of the transfer bracket 1, the suction mechanism 2 includes a Y-shaped gripper 201, and the Y-shaped gripper 201 is installed on the transfer bracket 1. On one side, there are high-pressure air chambers 202 on both sides of the Y-shaped gripper 201, and jet holes 203 are evenly opened on the top of the high-pressure air chamber 202. Inside the jet holes 203, there is a bias flow blocking column 204, and the top side of the bias flow blocking column 204 is installed There is a deflector side plate 205, using the Bernoulli principle, the high-pressure body jet is ejected from the jet hole 203 through the high-pressure air chamber 202, and the jet gas is sprayed laterally around the surface of the Y-shaped claw 201 through the deflection blocking column 204, thereby A cyclone is generated between the surface of the Y-shaped gripper 201 a...

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Abstract

The invention discloses non-contact wafer transfer equipment, and belongs to the field of wafer production. The non-contact wafer transfer equipment comprises a transfer support. A suction mechanism is mounted on one side of the transfer support, is used for sucking and fixing a wafer in a non-contact manner, and comprises a Y-shaped gripper. The Y-shaped gripper is installed on one side of the transfer support, high-pressure air cavities are formed in the two sides of the interior of the Y-shaped gripper, jet flow holes are evenly formed in the tops of the high-pressure air cavities, bias flow blocking columns are arranged in the jet flow holes, and flow guide side plates are installed on one sides of the tops of the bias flow blocking columns. A transfer mechanism is arranged between the Y-shaped gripper and the transfer support. A wafer can be firmly grabbed in a non-contact mode by means of the Bernoulli principle, and the problem that distortion or fragmentation of a wafer can be possibly caused by a traditional manual carrying mode and a common negative pressure vacuum suction carrying mode is solved.

Description

Technical field [0001] The present invention relates to the field of wafer production, and more specifically, to a contactless wafer transfer equipment. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms silicon wafers, that is, wafers. At present, domestic wafer production lines are mainly 8-inch and 12-inch, and transfer equipment is required to move the wafer during inspection and etching. [0003] However, the existing wafer transfer methods using traditional manual handling and ordinary negative pressure vacuum suction and handling methods may cause the wafer to be distorted, deformed or broken. Contents of the invention [0004] 1. Technical issues to be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838
Inventor 赵学灵彭梓洋
Owner 苏州桓旭半导体科技有限公司
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