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Electronic device and assembly thereof

A technology for electronic equipment and components, applied in the field of communication, can solve the problems of occupying height and affecting the thickness of electronic equipment, and achieve the effect of reducing thickness

Active Publication Date: 2015-03-11
HUIZHOU TCL MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the printed circuit board 11 and the connecting bracket 12 are fixed, because the nuts of the screws 13 have a certain height, they will occupy a certain height, so that when the printed circuit board 11 is connected with the touch screen 14 or other components, there will be more nuts of the screws 13. The cap height h, which affects the thickness of the electronic device

Method used

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  • Electronic device and assembly thereof
  • Electronic device and assembly thereof
  • Electronic device and assembly thereof

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Embodiment Construction

[0023] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0024] The present invention discloses an electronic device, which includes a touch screen 25 and electronic device components. Wherein the touch screen 25 can also be replaced with other material layers. Such as figure 1 as shown, figure 1 It is a schematic diagram of the structure of the first embodiment of the electronic equipment assembly of the present invention, the electronic equipment assembly includes a printed circuit board 21 , a metal steel sheet 22 , a connecting bracket 23 and a screw 24 . In this embodiment, the connecting bracket 23 is preferably an antenna bracket, of course, the connecting bracket 23 may also be other connecting devices. Wherein, the metal steel sheet 22 can also be replaced with other tough and hard ceramic sheets or other mixed metal sheets.

[0025] Please also refer to Figure 2-Figure 5 , the printed circui...

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PUM

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Abstract

The invention discloses an electronic device assembly. The electronic device assembly comprises: a printed circuit board; a metal steel sheet, wherein the metal steel sheet is mounted on the printed circuit board by an SMT process; a connection bracket connected to the printed circuit board; a screw, for sequentially passing through the printed circuit board, the metal steel sheet and the connection bracket, and fixing the printed circuit board to the connecting bracket, wherein, when the printed circuit board is fixed to the connection bracket, a horizontal plane where a top portion of the screw locates is lower than a horizontal plane where a side of the printed circuit board locates, and the side of the printed circuit board is a side far away from the connecting bracket. The invention also discloses an electronic device. By adopting the above-described manner, the electronic device assembly of the invention can reduce influence of height caused by a screw nut of the screw, and effectively reduce the thickness of the electronic device.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to an electronic equipment component and electronic equipment using the electronic equipment component. Background technique [0002] With the development of technology, electronic devices are getting thinner and thinner, so that the electronic device has a limit in the Z-direction space (thickness of the electronic device). Due to the limitation of the space in the Z direction, and in order to ensure the quality and appearance of the electronic equipment, we can only make full use of the space in the Z direction [0003] However, when it is necessary to connect components to screws, no matter how it is designed, it is inevitable to eliminate the height influence of the nut of the screw. Such as figure 1 In the electronic device shown, when the printed circuit board 11 is connected to the connecting bracket 12 , the printed circuit board 11 and the connecting bracket 12 are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/02
Inventor 刘超
Owner HUIZHOU TCL MOBILE COMM CO LTD