Substrate processing apparatus

A substrate processing device and substrate technology, applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve the problems of increasing mechanical damage, etc., and achieve the effect of easy maintenance and low temperature deviation

Active Publication Date: 2015-03-11
EUGENE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The second major issue is consistent thickness across the wafer
Inconsistent layers can lead to high electrical resistance on metal lines, increasing the likelihood of mechanical damage

Method used

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Embodiment approach

[0048] Below, will refer to Figure 4 Exemplary embodiments of the present invention are described in detail. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are presented so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the shapes of components are exaggerated for clarity.

[0049] Although the deposition process is described below as an example, the present invention is applicable to many substrate processes including the deposition process. In addition, those skilled in the art understand that the present invention is applicable to many objects to be processed other than the substrate W described in the embodiments.

[0050] Figure 4 is a schematic diagram of a substrate processing apparatus according to another embodiment of the present invention. see Fig...

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Abstract

A substrate processing apparatus, in which the processing of a substrate is carried out, according to one embodiment of the present invention, comprises: a main chamber having a passage which is formed on one sidewall thereof and through which the substrate moves in and out, and a top opening and a lower opening formed on the upper part and the lower part thereof, respectively; a chamber cover, which closes the top opening and forms a processing space which is separated from outside and in which the processing is carried out; a shower head which is installed in the processing space and has a plurality of injection holes for injecting processing gases; a lower heating block which is installed and fixed in the lower opening and has a lower installation space separated from the processing space, and on top of which the substrate is placed; and a plurality of lower heaters which are installed in the lower installation space in a direction parallel to the substrate and which heat the lower heating block.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus in which a heater is provided in an installation space separated from a processing space to heat a substrate. Background technique [0002] A semiconductor device consists of multiple layers on a silicon substrate. The plurality of layers is deposited on the substrate by a deposition process. This deposition process has a number of significant issues that are important for evaluating the deposited layer and selecting a deposition method. [0003] The first important issue is the quality of the deposited layer. This represents the composition, degree of contamination, defect density and mechanical and electrical properties of the deposited layer. The composition of the deposited layer can vary according to the deposition conditions, which is very important to obtain the specified composition. [0004] The second major issue i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/205
CPCC23C16/481H01L21/67109H01L21/205C23C16/4412C23C16/45565C23C16/46
Inventor 梁日光宋炳奎金劲勋金龙基申良湜
Owner EUGENE TECH CO LTD
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