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Partially recessed printed circuit board and manufacturing method thereof

A printed circuit board, local technology, applied in the direction of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of high temperature-resistant peelable adhesive, strong bonding force, unqualified printed circuit boards, and difficult to remove.

Active Publication Date: 2017-06-09
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has low alignment accuracy and is difficult to achieve mass production, and the high-temperature-resistant peelable adhesive has strong bonding force, is difficult to remove, and is easy to remain in the printed circuit board, resulting in unqualified printed circuit boards

Method used

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  • Partially recessed printed circuit board and manufacturing method thereof

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Embodiment Construction

[0021] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] figure 1 A schematic flowchart of a method for manufacturing a partially recessed printed circuit board according to an embodiment of the present invention is shown.

[0023] An embodiment of the present invention provides a method for manufacturing a partially recessed printed circuit board, the printed circuit board includes a laminated multi-layer core board, the outer core board is located on the outer layer, and the inner core board is located on the inner layer .

[0024] Such as figure 1 As shown, each core board is, for example, an FR-4 copper clad laminate, which includes a copper layer 1 and an FR-4 prepreg 2 .

[0025] In the method for manufacturing a partially recessed printed circuit board in this ...

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PUM

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Abstract

The invention provides a partially recessed printed circuit board and a manufacturing method thereof. The printed circuit board comprises laminated multilayer core boards, wherein the core board arranged at the external layer is an external layer core board, and the core board arranged at the internal layer is an internal layer core board. The manufacturing method of the partially recessed printed circuit board is characterized in that the method comprises the following steps that an internal layer pattern is manufactured on the internal layer core board; a copper foil is laminated on the position to be recessed on the internal layer core board. The external layer core board and the internal layer core board are laminated into the laminated boards. An external layer pattern is manufactured on the external layer core board so that core board base material arranged on the position to be recessed of the external layer core board is exposed. The core board base material arranged on the position to be recessed of the external layer core board is removed so that a recess is formed. The copper foil is removed.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards, in particular to a method for manufacturing partially recessed printed circuit boards. Background technique [0002] The surface of the ordinary printed circuit board is the same plane, but the surface of the partially recessed printed circuit board is not the same plane, for example, the drop between the two core board layers can reach 0.2mm-0.5mm. In order to reduce the thickness after assembly, more and more attention has been paid to the production technology of partially recessed printed circuit boards, but the recessed part needs to be realized by special technology. Chemical potion and resin pollution; 2. How to effectively remove the core board substrate on the local depression without damaging the printed circuit board. [0003] At present, in the manufacturing industry of printed circuit boards, there are the following methods to solve the above problems, but these m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4697
Inventor 刘大辉
Owner NEW FOUNDER HLDG DEV LLC