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Adhesive sheet for polishing pad

一种粘合片、研磨垫的技术，应用在研磨机床、研磨工具、研磨装置等方向，能够解决安装作业性问题等问题

Active Publication Date: 2022-06-17
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are problems in installation workability, such as it takes time to dry the adhesive, and solvent components evaporate during drying.

Method used

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  • Adhesive sheet for polishing pad
  • Adhesive sheet for polishing pad
  • Adhesive sheet for polishing pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0153] Hereinafter, some examples related to the present invention will be described, but the present invention is not intended to be limited to the aspects shown in the examples. In addition, "parts" and "%" in the following description are based on mass unless otherwise specified.

[0154]

[0155] (Preparation of rubber-based adhesive composition)

[0156] As a base polymer, 100 parts of a styrene-isoprene block copolymer (manufactured by Zeon Corporation, Japan, trade name "Quintac 3520", styrene content 15%, diblock copolymer ratio 78%), terpene 40 parts of phenolic resin, 30 parts of terpene resin, 0.75 part of isocyanate compound (product of Nippon Polyurethane Industry Co., Ltd., trade name "Corotate L"), 3 parts of anti-aging agent, and toluene as a solvent were stirred and mixed on the basis of solid content, thereby A rubber-based adhesive composition A with NV50% was prepared.

[0157] Here, as the terpene phenol resin, a total of 40 parts by mass ratio of 40 p...

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PUM

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Abstract

The present invention relates to an adhesive sheet for fixing a polishing pad. The present invention provides a polishing pad fixing adhesive sheet capable of firmly fixing a polishing pad. The pressure-sensitive adhesive sheet for fixing the polishing pad includes a pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet. In addition, the adhesive surface exhibited a 180-degree peel strength of 30 N / 20 mm or more on the stainless steel plate.

Description

technical field [0001] This application claims priority based on Japanese Patent Application No. 2013-190489 filed on September 13, 2013, the entire contents of which are incorporated herein by reference. technical field [0002] The present invention relates to an adhesive sheet for fixing a polishing pad. Background technique [0003] High surface smoothness of glass for liquid crystal, silicon wafer, hard disk, etc. is generally achieved by grinding. The polishing in the above-mentioned technique can be performed by, for example, placing the object to be polished on a polishing device, and supplying a polishing liquid containing abrasive grains while pressing the polishing pad mounted on the platform of the polishing device against the object, so that the object, Both the polishing pads are moved in parallel with respect to the surface of the object. The polishing pads used in the above-mentioned polishing are usually mounted and fixed to the platform of the polishing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/30C09J153/02C09J145/00C09J133/08B24B37/20
CPCB24B37/20C09J7/387B24B37/34C09J153/00Y10T428/2848C09J2301/124C09J2301/312
Inventor 铃木浩之山本修平
Owner NITTO DENKO CORP