LED light thermal module
A heat dissipation module and LED lamp technology, applied in lighting and heating equipment, cooling/heating devices of lighting devices, lighting devices, etc., can solve the problems of poor heat dissipation and short life of LED packaging, achieve simple structure and improve heat dissipation Efficiency, easy assembly effect
Inactive Publication Date: 2015-03-25
任湘宁
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Problems solved by technology
However, the light decay and lifespan of LED are directly related to its junction temperature. If the heat dissipation of LED package is not good, the junction temperature will be high and the lifespan will be short. When the temperature is 60 degrees, its luminescence is only 90%, when the junction temperature is 100 degrees, it drops to 80%, and at 140 degrees, only 70% remains
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[0017] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
[0018] Such as figure 1 , 2 As shown, the LED lamp heat dissipation module described in this embodiment includes a power supply 1, a heat sink 2, a printed circuit board 3 carrying LED lamp beads, a lens 4, a metal heat collecting bottom plate 5, and an inner mounting ring 6 and an outer mounting ring. The ring 7 and the first silicone ring 8 and the second silicone ring 9 that cooperate with the inner mounting ring 6 and the outer mounting ring 7 respectively. The radiator 2 includes an annular connection part 21, one end of the annular connection part 2 is provided with a heat sink 22, the printed circuit board 3 is pasted on the metal heat collecting bottom plate 5 and contacts the radiator 2 through the metal heat collecting bottom plate 5, and the power supply 1 is located...
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The invention relates to an LED light thermal module. The LED light thermal module comprises a power supply, a heat dissipation device, a printed circuit board where LED lamp beads are arranged, and a lens, wherein the printed circuit board is attached to a metal heat collection base plate and makes contact with the heat dissipation device through the metal heat collection base plate, an annular groove is formed in the side, making contact with the printed circuit board, of the metal heat collection base plate along the edge of the metal heat collection base plate, the power supply is arranged in a power pack, electrodes are led out through installation pins, the installation pins and electrodes of the power supply penetrate through installation holes in the metal heat collection base plate and installation holes in the printed circuit board in sequence, and electrode extension ends are welded onto the printed circuit board to achieve electrical signal transmission. By means of the special structural design of the metal heat collection base plate, heat dissipation efficiency is effectively improved. Furthermore, the LED light thermal module is simple in structure and convenient to assemble.
Description
technical field [0001] The invention relates to the technical field of LED heat dissipation. Background technique [0002] LED is a semiconductor that can convert electrical energy into visible light, and its energy consumption is only 1 / 10 of incandescent lamps and 1 / 4 of ordinary energy-saving lamps. In addition to the advantages of environmental protection and energy saving, LED lights also have many advantages such as long life, high luminous efficiency, and no radiation. Therefore, as an upgraded product of the next generation of lighting, LED is an emerging industry with great development potential. However, the light decay and lifespan of LED are directly related to its junction temperature. If the heat dissipation of LED package is not good, the junction temperature will be high and the lifespan will be short. When the temperature is 60 degrees, its luminescence is only 90%, when the junction temperature is 100 degrees, it drops to 80%, and at 140 degrees, only 70%...
Claims
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IPC IPC(8): F21V29/77F21Y101/02
CPCF21Y2101/00
Inventor 任湘宁
Owner 任湘宁