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Power capacitor high in heat dissipation performance

A technology of power capacitors and heat dissipation performance, applied in capacitors, fixed capacitors, multiple fixed capacitors, etc., can solve the problems of limited overcurrent capacity of capacitor cores, low current density of copper strips, and increased heat generation, and achieves overcoming creepage. The effect of shortening the distance, overcoming the falling off of the solder joint, and increasing the heat dissipation area

Active Publication Date: 2015-03-25
ANHUI TONGFENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the heat cannot be dissipated effectively and timely, it will greatly reduce the service life of the capacitor, and even affect the normal use of the capacitor.
[0003] In addition, if the over-current capability of the lead-out copper strip inside the capacitor is small, the uneven current distribution will make the local current too large, and the over-current capability of a single capacitor core is limited. damage, resulting in the capacitor not being able to work normally
[0004] For high-power power capacitors with cylindrical capacitor cores, since the capacitor cores are stacked up and down, the position of each core on the core group is inconsistent, and the current of each core is superimposed on the upper part when passing through the lead-out copper strip. , so that the current distribution on the lead-out copper strip is uneven, that is, the current density of the lower part of the lead-out copper strip is small and the upper part of the current density is large, resulting in excessive local current and increased calorific value, resulting in poor local heat dissipation, resulting in heat dissipation problems. Long-term operation will also cause damage to the capacitor, resulting in the capacitor not being able to work normally

Method used

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  • Power capacitor high in heat dissipation performance
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Embodiment Construction

[0014] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] like figure 1 As shown, the present invention includes a cover plate assembly 1 , a casing 2 and a capacitor core group 3 fixed in the casing 2 . One or more capacitor core groups 3 can be arranged side by side, and the outside of each capacitor core group 3 is wrapped with an insulating film and placed in the casing 2, and the insulating film is placed on the figure 1 is not drawn in. The positive and negative electrodes of the capacitor core group 3 are electrically connected to...

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Abstract

The invention relates to a power capacitor high in heat dissipation performance. The power capacitor high in heat dissipation performance comprises a cover plate assembly, a shell and a capacitor core assembly, wherein the capacitor core assembly is formed by overlaying a plurality of cylindrical capacitor cores, leading-out copper belts are arranged on the metal-sprayed surface of the capacitor core assembly, the two sides of each leading-out copper belt at least extend to the central areas of the metal-sprayed surfaces of the capacitor cores located on the two sides of the capacitor core assembly, a through hole or a groove is formed in the portion, corresponding to the center of the metal-sprayed surface of each capacitor core, of each leading-out copper belt, an opening of each groove is located on one side of the corresponding leading-out copper belt, and elastic fins which extend to the through holes or the grooves and are used for being electrically connected with the metal-sprayed surfaces through welding are arranged on the leading-out copper belts. According to the power capacitor high in heat dissipation performance, by increasing the widths of the leading-out copper belts, current can evenly pass through the power capacitor, and the amount of heat can be reduced; in addition, the areas of the leading-out copper belts are increased in a multiplied mode, and thus the heat dissipation performance is greatly improved.

Description

technical field [0001] The invention relates to a power capacitor, in particular to a power capacitor with good heat dissipation performance. Background technique [0002] When the capacitor is in normal operation, due to its own loss, the current will generate heat when it passes through the capacitor core, copper strip and solder joints and other connecting parts. If the heat cannot be dissipated effectively and timely, it will greatly reduce the service life of the capacitor, and even affect the normal use of the capacitor. [0003] In addition, if the over-current capacity of the lead-out copper strip inside the capacitor is small, the uneven current distribution will make the local current too large, and the over-current capacity of a single capacitor core is limited. Damage, resulting in the capacitor can not be used normally. [0004] For high-power power capacitors with cylindrical capacitor cores, since the capacitor cores are stacked up and down, the position of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/38H01G4/248H01G4/224
Inventor 储松潮潘毓娴张进汪威刘殿明
Owner ANHUI TONGFENG ELECTRONICS
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