A plastic packaging material discharge device

A discharge device and molding compound technology, applied in the field of molding compound processing, can solve the problems of uneven blanking of plastic sealing compound, waste of raw materials, increase of production cost, etc., to avoid accumulation, avoid plastic empty material falling, and save production cost effect

Inactive Publication Date: 2016-07-20
CHENGDU ADVANCED POWER SEMICON
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the processing of the molding compound, the molding compound in the molding compound box tends to accumulate at the outlet, which easily leads to uneven blanking of the molding compound, and when the molding compound box is pulled out, the molding compound on the edge of the outlet part tends to fall off , resulting in waste of raw materials, thereby increasing production costs

Method used

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  • A plastic packaging material discharge device
  • A plastic packaging material discharge device

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Embodiment Construction

[0013] The present invention will be further described below in conjunction with accompanying drawing, protection scope of the present invention is not limited to the following:

[0014] Such as figure 1 and figure 2 As shown, a plastic sealing compound discharging device includes a plastic sealing material box 1. The lower side wall of the plastic sealing material box 1 protrudes outward to form an outlet part 2. The front end of the outlet part 2 is open at the top. The top of the end is an inclined cover 3, and the outlet part 2 is connected with a baffle plate 5 through a hinge 4. The baffle plate 5 is provided with two positioning support plates 6, and the hinge 4 is located on the two positioning support plates. 6, the hinge 4 is covered with a torsion spring 7, one leg of the torsion spring 7 is located on the material stopper 5, the other leg of the torsion spring 7 is located on the cover 3, and the hinge 4 is on the torsion spring 7 It can be closed automatically ...

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PUM

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Abstract

The invention discloses a discharging device of a plastic package material. The discharging device of the plastic package material comprises a plastic package material box (1); the lower part of one side wall of the plastic package material box (1) is outwards protruded to form an outlet part (2); the top of the front end of the outlet part (2) is opened; the top of the rear end of the outlet part (2) is an inclined close cover (3); the outlet part (2) is connected with a material baffle (5) through a hinge (4); the material baffle (5) is provided with two positioning support plates (6); the hinge (4) is located between two positioning support plates (6); the hinge (4) is sleeved with a torsional spring (7); one support leg of the torsional spring (7) is located on the material baffle (5), and the other support leg of the torsional spring (7) is located on the close cover (3); a stainless steel material stopper (8) is fixedly connected in the outlet part (2); and the stainless steel material stopper (8) is located under the close cover (3). The beneficial effect of the discharging device of the plastic package material is simple structure, convenient operation and low production cost.

Description

technical field [0001] The invention relates to the processing of plastic sealing compound, in particular to a plastic sealing compound discharging device. Background technique [0002] Epoxy molding compound (EMC-Epoxy Molding Compound) is epoxy resin molding compound and epoxy molding compound. Powder molding compound made by mixing additives. More than 97% of plastic packaging (referred to as plastic packaging) materials use EMC. The plastic packaging process uses transfer molding to extrude EMC into the mold cavity, embeds the semiconductor chip in it, and cross-links and solidifies it at the same time to become a product with a certain structural appearance. Semiconductor device. [0003] During the processing of the molding compound, the molding compound in the molding compound box tends to accumulate at the outlet, which easily leads to uneven blanking of the molding compound, and when the molding compound box is pulled out, the molding compound on the edge of the o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/54B29C70/48
CPCB29C70/48B29C70/54
Inventor 陈太兵何伟黄勇黄荣鑫黄小勇
Owner CHENGDU ADVANCED POWER SEMICON
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