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Method for filling through hole by electroplating

A technology of electroplating tank and electroplating device, which is applied in the direction of forming electrical connection of printed components, etc., can solve the problems of long time for electroplating to fill through holes, reduce the time for filling through holes, etc., achieve good filling effect of through holes, improve the effect of filling through holes, The effect of reducing fill time

Inactive Publication Date: 2015-04-22
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on this, it is necessary to provide a method for electroplating and filling through holes, which can relatively reduce the filling time of through holes and improve production efficiency.

Method used

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  • Method for filling through hole by electroplating
  • Method for filling through hole by electroplating
  • Method for filling through hole by electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method of electroplating and filling through holes, comprising the following steps:

[0024] 1) if figure 1 As shown, the electroplating device is adopted, and the electroplating device includes an electroplating tank 1, an electroplating solution 2, a power supply 3, and an anode 4. The electroplating solution 2 is housed in the electroplating tank 1, the anode 4 is connected to the positive pole of the power supply 5, and the anode 4 is placed in the electroplating tank 1. In electroplating solution 2;

[0025] 2) Connect the part 6 to be plated with the through hole 61 to the negative pole of the power supply 5, and place it in the electroplating solution 2 of the electroplating tank 1;

[0026] In this step, the piece to be plated 6 with the through hole 61 is connected to the power supply 5 as a cathode, and under the action of the electroplating solution, the piece to be plated 6 forms a circuit with the power supply 5 and the anode 4 .

[0027] 3) Control the...

Embodiment 2

[0038] On the basis of the first embodiment, this embodiment cooperates with the work of controlling the jet flow device during the electroplating process.

[0039] A method of electroplating and filling through holes, comprising the following steps:

[0040] 1) if figure 1 As shown, an electroplating device is adopted, and the electroplating device includes an electroplating tank 1, an electroplating solution 2, a power supply 3, an anode 4, and a jet flow device 5, and the electroplating tank 1 is equipped with an electroplating solution 2, and the jet flow device 5 is connected with the electroplating tank 1, and the spray flow device 5 is connected to the electroplating tank 1. The flow device 5 is provided with a nozzle 51 located in the electroplating tank 1, the anode 4 is connected to the positive pole of the power supply 5, and the anode 4 is placed in the electroplating solution 2 of the electroplating tank 1;

[0041] The jet flow device 5 sucks the electroplating ...

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PUM

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Abstract

The invention particularly relates to a method for filling a through hole by electroplating. The method comprises the following steps that (1) an electroplating device is adopted; (2) a piece to be electroplated with the through hole is connected with the negative electrode of a power source and is placed in an electroplating solution of an electroplating bath; (3) the power source is controlled to work according to a control condition, and continuous electroplating in T time is conducted, wherein T is larger than zero. The control condition is that within the initial stage T1 period, and the electric current density J1 of the piece to be electroplated is 2-3 ASD, wherein T1 / T is larger than or equal to 30% and smaller than or equal to 50%; within the mid-term stage T2 period, the electric current density J2 of the piece to be electroplated is 0.5-1.5 ASD, wherein T2 / T is larger than or equal to 20% and smaller than or equal to 40%; within the terminal stage T3 period, the electric current density J3 of the piece to be electroplated is 1.0-2.0 ASD, T3 is equal to T-T1-T2, J1 is larger than J3, and J3 is larger than J2. According to the method, the filling time of the through hole can be relatively shortened, and the production efficiency can be better improved.

Description

technical field [0001] The invention relates to electroplating technology, in particular to a method for electroplating and filling through holes. Background technique [0002] During the manufacturing process of the printed circuit board, the through holes on the printed circuit board need to be filled; at present, the through hole filling technology is mostly used to fill the through holes. [0003] Generally, the electroplating device includes an electroplating tank, an electroplating solution, a power supply, and an anode. The electroplating tank is filled with the electroplating solution, the anode is connected to the positive pole of the power supply, and the anode is placed in the electroplating solution in the electroplating tank. The electroplating device is usually also provided with a jet flow device connected to the electroplating tank, the jet flow device is provided with a spray pipe, and the spray pipe is provided with a nozzle. The jet flow device sucks the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D5/00C25D5/08
CPCC25D5/08C25D7/00H05K3/42
Inventor 崔正丹谢添华李志东
Owner GUANGZHOU FASTPRINT CIRCUIT TECH