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Wafer holder with solder wire coil groove

A wafer seat and coil technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of insufficient wafer seat adhesion, detachment, and tin liquid overflowing the wafer seat, etc., to improve the contact range and increase the adhesion. Effect

Inactive Publication Date: 2015-04-29
WUXI KENUODA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a carrier for carrying the wafer, the wafer holder is also a very important part in actual processing, but the traditional wafer holder does not have enough adhesion when welding with the wafer, which can easily cause the two to separate, and the tin liquid will overflow during welding Wafer holders pose certain problems

Method used

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  • Wafer holder with solder wire coil groove

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Embodiment Construction

[0012] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0013] see figure 1 , the embodiment of the present invention includes:

[0014] A wafer holder with welding wire coil grooves, comprising a wafer holder body 1, a coil groove 2 is provided on the upper end surface of the wafer holder body 1, the coil groove 2 is a closed multi-turn ring structure, and the coil A coil wire 3 is embedded in the groove 2, and a convex solder point 4 is provided on the coil wire 3.

[0015] In addition, the interval lengths between the annular groove walls on the coil groove 2 are the...

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PUM

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Abstract

The invention discloses a wafer holder with a solder wire coil groove. The wafer holder comprises a wafer holder body, wherein a coil groove is formed in the upper end surface of the wafer holder body; the coil groove is in a closed annular structure; a coil wire is embedded in the coil groove; solder bumps are arranged on the coil wire. Through the adoption of the scheme, the wafer holder with a solder wire coil groove can increase the degree of adhesion when the wafer and the wafer holder are soldered; the annular coil type structure and the added solder bumps greatly enlarge the contact range; besides, excessive molten tin can fall into the coil groove rather than overflow the wafer holder during soldering.

Description

technical field [0001] The invention relates to the field of wafer seats, in particular to a wafer seat with a welding wire coil groove. Background technique [0002] Semiconductors or chips are produced from silicon. Etched into the wafer are millions of transistors hundreds of times smaller than a human hair. Semiconductors manage data by controlling current to form various characters, numbers, sounds, images and colors. They are widely used in integrated circuits and indirectly by everyone on the planet. These applications range from everyday applications such as computers, telecommunications and television to advanced microwave transmission, laser conversion systems, medical diagnostic and therapeutic equipment, defense systems and NASA space shuttles. As a carrier for carrying the wafer, the wafer holder is also a very important part in actual processing, but the traditional wafer holder does not have enough adhesion when welding with the wafer, which can easily caus...

Claims

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Application Information

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IPC IPC(8): H01L23/13H01L23/488
Inventor 黄根友
Owner WUXI KENUODA ELECTRONICS