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Method for overturning and testing electronic assembly

A technology of electronic components and testing methods, which is applied in the field of testing, can solve problems such as slowing down of testing operations, inability to clamp chips at the same time, and detection efficiency of electronic components, and achieve the effect of improving detection efficiency

Inactive Publication Date: 2015-05-06
ARKTEK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the positioning device can only clamp one chip or a small number of chips to the test device at a time, and cannot clamp the entire disk of chips to the test device at the same time, resulting in the need to clamp one by one when multiple chips need to be detected. The mode causes the detection operation to slow down
[0004] Therefore, it is necessary to develop a new type of flipping and testing method to solve the problem of detection efficiency of the above-mentioned electronic components

Method used

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  • Method for overturning and testing electronic assembly
  • Method for overturning and testing electronic assembly
  • Method for overturning and testing electronic assembly

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Embodiment Construction

[0033] The description of the present invention provides different examples to illustrate the technical features of different implementations of the present invention. The configuration of each component in the embodiment is for clearly illustrating the content disclosed in the present invention, and is not intended to limit the present invention.

[0034] refer to figure 1 , figure 2 as well as image 3 , figure 1 It is a three-dimensional schematic diagram of an electronic component flipping and testing system according to an embodiment of the present invention; figure 2 It is a three-dimensional schematic diagram of the turning / testing seat body 100 of the turning and testing system according to the embodiment of the present invention; image 3 It is a three-dimensional schematic diagram of the turning unit 102 of the turning and testing system according to the embodiment of the present invention. The turning and testing system of the present invention includes a tur...

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Abstract

The invention relates to a method for overturning and testing an electronic assembly, and is applicable to an overturning and testing system. The characteristics of the invention are that steps of overturning, inspecting and testing a plurality of electronic assemblies by an overturning / testing seat body and an overturning unit are finished sequentially at one time. By means of the overturning / testing seat body and the overturning unit, the efficiency of testing the electronic assembly is raised.

Description

【Technical field】 [0001] The invention relates to a testing method, and in particular to a flipping and testing method of an electronic component. 【Background technique】 [0002] With the rapid development of electronic information technology and the continuous development and innovation of electronic products, various circuit chips have emerged, such as network chips, interface chips and display chips, etc., which have become the medium for function expansion or signal transmission of electronic products. Before, it had to be inspected to rule out defective products with abnormal internal circuits of the chip. Therefore, in the chip production process, testing is a very important link. Basically, whether the chip can operate normally is to detect the chip through the testing device to determine whether the chip is good or bad. [0003] In a prior art, the test device places the chip to be tested in the pre-positioning area of ​​the test device manually or by a positioning...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04G01R31/01
Inventor 林源记
Owner ARKTEK