Alignment-free Headphone cable extrusion mold system and manufacturing method of headphone cable extrusion mold system

A wire and centering technology, applied in the field of headphone wire centering-free extrusion mold system, can solve problems such as huge consumption of raw materials, and achieve the effects of stable product quality, uniform outer quilt and cost saving.

Inactive Publication Date: 2015-05-13
ZHONGSHAN TIANJIAN ELECTROACOUSTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Over the years, the extrusion molds for earphone wires used have adopted a matching structure in which the guide cone is radially fixed and axially adjustable, while the die can be adjusted in four directions in the radial direction. Although the mold processing technology of this structure is simple , but in the production process it is necessary to manually adjust the eccentricity of the core wire to achieve the requirement of uniform and consistent radial thickness of the outer core wire, which brings many problems such as huge consumption of raw materials

Method used

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  • Alignment-free Headphone cable extrusion mold system and manufacturing method of headphone cable extrusion mold system

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Embodiment Construction

[0014] refer to figure 1 , figure 1 It is a structural schematic diagram of a specific embodiment of the present invention. As shown in the figure, an alignment-free extrusion mold system for earphone wires includes a die 1 and a guide cone 3, and a mold core is arranged between the die 1 and the guide cone 3 2. The die 1 is provided with a die hole 11 for forming the wire core, the guide cone 3 is provided with a wire core hole 31 for wire core delivery, and the die core 2 is provided with a wire core hole 31 for wire The core is positioned to the core hole 21 in the center of the hole 11 .

[0015] A method for manufacturing an alignment-free extrusion mold system for earphone wires, comprising the following steps:

[0016] (1) To process the die 1, the same clamping is used to complete the processing of the die hole 11 and the core distribution groove 12 of the die 1 at one time;

[0017] (2) Process the mold core 2, adopt the same clamping, and complete the processing o...

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Abstract

The invention discloses an alignment-free headphone cable extrusion mold system and a manufacturing method of the headphone cable extrusion mold system. The mold system comprises a mouth mold, a guide cone and a mold core arranged between the mouth mold and the guide cone; during manufacture, the mouth mold and the mold core are clamped once, processed once and integrally assembled, and the coaxiality of a mold hole and a mold core hole is greatly guaranteed, so that a cable core can be accurately positioned in the center of the mold hole through the mold core hole, the alignment work of a conventional mold is avoided, a cable core jacket is uniform, a produced product quality is stable, the consistency is good, the boot time is shortened, the productivity and the success rate of one-time boot are increased, the cost can be effectively saved, the mold core can be replaced according to different cable cores, cables and wear conditions, and use and maintenance are very convenient.

Description

technical field [0001] The invention relates to a centering-free extrusion mold system for earphone wires and a manufacturing method thereof. Background technique [0002] Over the years, the extrusion molds for earphone wires used have adopted a matching structure in which the guide cone is radially fixed and axially adjustable, while the die can be adjusted in four directions in the radial direction. Although the mold processing technology of this structure is simple , but in the production process, it is necessary to manually adjust the eccentricity of the core wire to achieve the uniform and consistent radial thickness of the core wire outer jacket, which brings many problems such as huge consumption of raw materials. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the present invention provides an alignment-free extrusion mold system for earphone wires and a manufacturing method thereof. [0004] The technical solution adopt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C47/12B29C33/38B29C48/30
CPCB29C33/3842B29C48/30B29C48/32
Inventor 陈新松张弢周维
Owner ZHONGSHAN TIANJIAN ELECTROACOUSTIC
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