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Bonding and connecting machine and bonding and connecting method

A connection machine and bonding technology, applied in the direction of chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve the problems of low automation, low efficiency, high equipment cost, etc., to improve automation and assembly efficiency , the effect of reducing costs

Active Publication Date: 2017-11-07
SHENZHEN LIANDE AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In this way, in the prior art, usually only a single machine can realize one process lamination and assembly operation of one product, which is not only inefficient, but also has a low degree of automation, and the cost of equipment configured for the same production capacity is high

Method used

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  • Bonding and connecting machine and bonding and connecting method
  • Bonding and connecting machine and bonding and connecting method
  • Bonding and connecting machine and bonding and connecting method

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] It can be understood that the terms "first", "second" and the like used in the present invention can be used to describe various elements herein, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first client could be termed a second client, and, similarly, a second client could be termed a first client, without departing from the scope of the present invention. Both the first client and the second client are clients, but they are not the same client.

[0032] figure 1 It is a schematic diagram of t...

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Abstract

An joint linking machine comprises an OCA (optically clear adhesive) stacking mechanism, a pull tape mechanism, a film tearing manipulator, an OCA image taking mechanism, a TP (touch panel) feeding mechanism, a TP image taking mechanism, a transfer platform mechanism, a TP carrying mechanism, an automatic film tearing mechanism, a TP and OCA conveying platform mechanism, an LCM (liquid crystal module) feeding platform, a film tearing failure waste receiving mechanism, a TP and OCA image taking mechanism and an LCM image taking mechanism, wherein the film tearing failure waste receiving mechanism moves to the automatic film tearing mechanism and receives TPs which are provided with films failed to be torn by the automatic film tearing mechanism and jointed with the OCA, or feeds the TPs located on the film tearing failure waste receiving mechanism and jointed with the OCA to the automatic film tearing mechanism. The joint linking machine has the advantages of high degree of automation and high assembly efficiency. The invention further discloses an joint linking method.

Description

【Technical field】 [0001] The invention relates to the technical field of a touch screen production line, in particular to a bonding and connecting machine and a bonding and connecting method for automatically assembling a touch screen. 【Background technique】 [0002] Today, with the rapid development of touch screen products, product differentiation is no longer the special pursuit of enterprises. The ultimate goal is to reduce production costs and adapt to the mainstream production situation of automation in the future. As far as the key bonding process of TP (Touch Panel, touch screen) and LCM (Liquid Crystal Module, liquid crystal module) (or bonding of cover and sensor) in the touch screen industry is concerned, basically the TP and solid-state OCA ( Optically Clear Adhesive (Optical Clear Adhesive) lamination, followed by TP and LCM lamination (or cover and sensor lamination), which require OCA soft-to-hard lamination equipment and TP and LCM hard-to-hard vacuum laminat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B38/10
CPCB32B37/10B32B38/10
Inventor 武杰李浩贾伟陶红志刘文生肖云湖
Owner SHENZHEN LIANDE AUTOMATION EQUIP