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Device and method for multi-partition application layer interconnection of tide tissot K1

An application-layer, multi-partition technology, applied in the direction of network interconnection, data exchange through path configuration, digital transmission system, etc., can solve the problems of increasing equipment cost, implementing personnel work cost, unfavorable server high integration, high performance requirements, etc. Achieve the effect of high practicability, reasonable design and simple overall structure

Inactive Publication Date: 2015-05-13
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing external switching devices are independent devices, which is not conducive to the high integration and high performance requirements of the server itself, and the addition of external devices will increase the cost of equipment and the work costs of implementation personnel, etc.

Method used

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  • Device and method for multi-partition application layer interconnection of tide tissot K1

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A device for multi-partition application layer interconnection of Inspur Tiansuo K1 according to the present invention, including two-by-two interconnection: Gigabit network card 1, IO module 2, Gigabit network switching module 3 and K1 backplane 4, Gigabit network card 1 and IO module 2 are used to provide network functions, Gigabit network switching module 3 and K1 backplane 4 are used to provide network switching functions.

[0023] The gigabit network card 1 is integrated on the IO module 2, and the gigabit network switching module 3 is integrated on the K14 backplane.

[0024] In the Inspur Tiansuo K1 system, an IO module 2 integrated with a Gigabit network card 1 and a K1 backplane 4 integrated with a Gigabit network switching module 3 are added to provide network functions and network switching functions respectively, thus realizing the application layer interconnected.

Embodiment 2

[0026] A method for the multi-partition application layer interconnection of Inspur Tiansuo K1 according to the present invention includes the following steps:

[0027] (1) The IO module 2 of the Inspur Tiansuo K1 system integrates a gigabit network card 1, and the K1 backplane 4 integrates a gigabit network switching module 3;

[0028] (2), Gigabit network card 1, IO module 2, Gigabit network switching module 3 and K1 backplane 4 are interconnected in pairs;

[0029] (3), Gigabit network card 1 provides network functions;

[0030] (4), Gigabit network switching module 3 provides network switching function;

[0031] (5) Gigabit network switching module 3 and Gigabit network card 1 perform network configuration to realize the application layer interconnection of Inspur Tiansuo K1 system.

[0032] After the gigabit network card 1 is integrated into the IO module 2, the IO module 2 can be equipped with a network card device without inserting an external network card on the IO m...

Embodiment 3

[0034] A method for the multi-partition application layer interconnection of Inspur Tiansuo K1 according to the present invention includes the following steps:

[0035] (1) The IO module 2 of the Inspur Tiansuo K1 system integrates a gigabit network card 1, and the K1 backplane 4 integrates a gigabit network switching module 3;

[0036] (2), Gigabit network card 1, IO module 2, Gigabit network switching module 3 and K1 backplane 4 are interconnected in pairs;

[0037] (3), Gigabit network card 1 provides network functions;

[0038] (4), Gigabit network switching module 3 provides network switching function;

[0039] (5) Gigabit network switching module 3 and Gigabit network card 1 perform network configuration to realize the application layer interconnection of Inspur Tiansuo K1 system.

[0040] The gigabit network switching module 3 provides the gigabit network card 1 with network parameters required for interconnection through DHCP service or static IP allocation. Make th...

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Abstract

The invention discloses a device and a method for multi-partition application layer interconnection of a tide tissot K1, and belongs to application layer interconnection methods. The method for multi-partition application layer interconnection of the tide tissot K1 includes the steps: (1) integrating a gigabit network card on an IO (input output) module of a tide tissot K1 system, and integrating a gigabit network exchange module on a K1 back board; (2) pairwise connecting the gigabit network card, the IO module, the gigabit network exchange module and the K1 back board; (3) providing a network function by the gigabit network card; (4) providing a network exchange function by the gigabit network exchange module; (5) performing network configuration for the gigabit network exchange module and the gigabit network card, and interconnecting application layers of the tide tissot K1 system. The integrated application layer interconnection device is used for interconnecting the multi-partition application layers in a server, simple in integral structure, reasonable in design and high in practicability.

Description

technical field [0001] The present invention relates to a method for application layer interconnection, in particular to a device and method for multi-partition application layer interconnection of Inspur Tiansuo K1. Background technique [0002] Inspur Tiansuo K1 system is the research and development result of "high-end fault-tolerant computer system", a major special project of my country's 863 plan. This product adopts modular design, and can support 32 processors, 2048GB memory in a single node, and has an input and output processing capacity of 960GB / s. As my country's first large-scale mainframe system, the successful development of Inspur Tiansuo K1 has broken the long-standing technical blockade of developed countries such as Europe and the United States, and successfully established "key technologies for large-scale mainframe architecture design" and "multi-level software and hardware integration" for the first time. Fault-tolerant system" two core technology groups...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04L12/46H04L12/931
Inventor 张明明陈良华赵宝捷马源
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD