Full-automatic laser spot welding device for IC chip
A laser spot welding, fully automatic technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problem of low efficiency of welding technology and achieve the effect of improving production efficiency
Inactive Publication Date: 2015-05-20
CHIZHOU RICHSEMI ELECTRONICS
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is to provide a fully automatic laser spot welding device for IC chips to solve the problem of extremely low efficiency of the existing welding technology
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[0021] In the following, numerous specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments. It will be apparent, however, to one skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other instances, well known processing steps have not been described in detail.
[0022] Such as figure 1 As shown, it includes a frame 1, a fixed seat 2, a servo motor 3, a screw rod 4, a mobile mounting seat 5, a laser welding head 6, a pneumatic vacuum suction 7, a rotary servo motor 8, a welding wire machine 9, and a conveyor 10. The fixed seat 2 described above is located at the right end of the top center of the frame 1, and the two are connected by threads. Said, the servo motor 3 is located at the center of the right end of the fixing base 2, and the two are connected by threads, and the screw mandrel 4 is located at the center of the left end of the serv...
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The invention discloses a full-automatic laser spot welding device for an IC chip. The full-automatic laser spot welding device for the IC chip comprises a rack, an IC chip, a fixing seat, a servo motor, a lead screw, a movable installation seat, a laser welding head, a pneumatic vacuum sucker, a rotating servo motor, a wire welding machine and a conveyor. The chip to be machined is placed in a storage frame of the conveyor at first, the servo motor drives the movable installation seat and enables the pneumatic vacuum sucker to move to the center of the upper end of the conveyor, the pneumatic vacuum sucker moves downwards and sucks the chip to be machined, the servo motor drives the movable installation seat to move back again, the pneumatic vacuum sucker places the chip to be machined in a positioning die, a thin copper wire is conveyed to the welding position of the IC chip through the wire welding machine, the laser welding head emits high-energy electron beams, and therefore welding machining of the chip is completed. After one side of the chip is successfully machined, the rotating servo motor rotates to enable the IC chip to be changed to another direction for welding machining, and therefore full-automatic welding machining is achieved, and production efficiency is improved.
Description
technical field [0001] The invention relates to a welding device, in particular to an IC chip full-automatic laser spot welding device. Background technique [0002] With the development of science and technology, electronic products are becoming more and more advanced, and the volume is getting smaller and smaller. The root of the development of electronic products lies in the extensive use of IC chips. The current IC chips need to be formed by welding with other lines, and IC chips are usually It is to contain tiny copper wires in multiple directions. The current technology is to weld one position first, and then manually change it to another position after the welding of the first position is completed, resulting in extremely low efficiency. In view of the above-mentioned defects, it is necessary to design a kind of IC chip full-automatic laser spot welding device. Contents of the invention [0003] The technical problem to be solved by the present invention is to prov...
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IPC IPC(8): B23K26/22B23K26/70
CPCB23K26/22
Inventor 陈友兵宋越徐和平
Owner CHIZHOU RICHSEMI ELECTRONICS