Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device

Abstract

A method of manufacturing a semiconductor chip according to an embodiment includes forming on a semiconductor substrate a plurality of etching masks each including a protection film to demarcate a plurality of first regions of the substrate protected by the plurality of etching masks and a second region as an exposed region of the substrate, and anisotropically removing the second region by a chemical etching process to form a plurality of grooves each including a side wall at least partially located in the same plane as an end face of the etching mask and a bottom portion reaching a back surface of the substrate, thereby dividing the semiconductor substrate into a plurality of chip main bodies corresponding to the plurality of first regions.

Description

[0001] This application is based on and enjoys the priority of Japanese Patent Application No. 2013-235470 filed on November 13, 2013, the entire contents of which are hereby incorporated by reference. technical field [0002] Embodiments of the present invention relate to a method of manufacturing a semiconductor chip, a semiconductor chip, and a semiconductor device. Background technique [0003] Singulation from a semiconductor substrate to chips generally uses blade dicing in which a rotating blade mechanically cuts a wafer. In blade dicing, a plurality of dicing grooves are sequentially formed on a semiconductor substrate, and the semiconductor substrate is singulated into chips. Therefore, there is a problem in blade dicing that if the chip size is reduced and the number of dicing grooves (the number of lines) is increased, the dicing time becomes longer in proportion to the number of lines. [0004] In addition, the corners of chips obtained by cutting with a knife e...

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Problems solved by technology

Therefore, there is a problem in blade dicing that if the chip size is reduced and the number of dicing grooves (number of lines) is increased, the dicing time becomes longer in proportion to the number of lines.

[0004] In addition, the corners of the chip obtained by cutting with a knife edge are right angles, and the impact resistance is low

Moreover, cutting with a knife edge produces microscopic chipping at the end of the chip, so the resulting chip has low flexural strength

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