Heat exchange device and semiconductor refrigeration refrigerator with same
A heat exchange device and semiconductor technology, applied in indirect heat exchangers, household refrigeration devices, coolers, etc., can solve the problems of large installation space, unsuitable installation, and large heat exchanger volume, so as to reduce volume and improve The effect of heat dissipation or cooling efficiency and compact structure
Active Publication Date: 2017-04-26
HAIER SMART HOME CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
This kind of heat exchanger is relatively large in size and requires a large installation space, so it is not suitable for installation in a small space.
In addition, the existing heat exchangers may not be able to achieve the desired effect for heat sources with high heat flux density such as semiconductor refrigeration chips
Method used
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Embodiment Construction
[0026] figure 1 is a schematic front view of a heat exchange device according to an embodiment of the present invention. Such as figure 1 shown, and refer to figure 2 with image 3 . Embodiments of the present invention provide a heat exchange device with a compact structure. The heat exchange device may generally include a plurality of fins 400 and a fan 500 , and the plurality of fins 400 are correspondingly arranged in parallel and spaced apart to form a fin group. In particular, in the heat exchange device of the embodiment of the present invention, each fin 400 is provided with a receiving through hole 410 and at least one through-pipe through hole 420 spaced apart from the receiving through hole 410 , and the receiving of each fin 400 The through holes 410 are configured such that the fin group defines a receiving space 430 extending along the axis of each receiving through hole 410 . The fan 500 is disposed in the accommodation space 430 . The blower 500 can be ...
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Provided are a heat exchange device and a semiconductor cooling refrigerator having said heat exchange device; the heat exchange device comprises a plurality of fins (400) and a fan (500); the plurality of fins (400) are arranged parallel to each other and at intervals, forming a fin assembly; each of the fins (400) is provided with an accommodating through-hole (410) and at least one through-hole for pipe penetration (420) spaced at an interval from the accommodating through-hole (410); the accommodating through-hole (410) of each of the fins (400) is configured to cause the fin assembly to define an accommodating space (430) extending along the axis of each of the accommodating through-holes (410); the fan (500) is arranged in the accommodating space (430). The fan (500) in the heat exchange device and semiconductor cooling refrigerator having same is mounted in the fin assembly, thus the structure of the heat exchange device is compact and the volume of the heat exchange device is significantly reduced.
Description
technical field [0001] The invention relates to the technical field of heat exchange equipment, in particular to a heat exchange device and a semiconductor refrigeration refrigerator provided with the heat exchange device. Background technique [0002] The heat exchanger in the prior art can be composed of a plurality of fins arranged in parallel at predetermined intervals, a plurality of heat transfer tubes inserted approximately vertically into each fin and having a refrigerant flow inside, and a fin for forced convection to dissipate heat. fan composition. Existing fans can be directly fixed to the circumferential edge of each fin to blow airflow to the gap between every two adjacent fins, or suck airflow from the gap between every two adjacent fins . This kind of heat exchanger is relatively large in size and requires a large installation space, and is not suitable for installation in a small space. In addition, the existing heat exchangers may not be able to achieve ...
Claims
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IPC IPC(8): F28D15/02F25D19/00
CPCF28D15/02F28F1/10
Inventor 陶海波张奎刘建如李鹏李春阳戚斐斐姬立胜
Owner HAIER SMART HOME CO LTD