Two-way synchronous hot-press device for packaging braid of chip component

Abstract

The invention discloses a two-way synchronous hot-press device for packaging a braid of a chip component. The two-way synchronous hot-press device comprises a horizontal workbench, a hot-press mechanism, a driving mechanism, a distance regulating mechanism and the like, wherein the hot-press mechanism is designed to be of a two-way structure and is used for sealing a material strip to ensure the pressure consistency so as to further complete good heat sealing of the material strip; the driving mechanism is used for driving the hot-press mechanism to achieve the up-down movement in the vertical direction; the distance regulating mechanism is used for regulating the distance between two sides of the workbench and the distance between pressing heads on the two sides, so that heat sealing adapting to material strips with different widths is further achieved. Through the device, the uniform temperature distribution of the pressing head on the single side, the temperature and pressure consistency of the pressing heads on the two sides and the good heat sealing of the material strips with different widths can be achieved, and meanwhile, the two-way synchronous hot-press device has the advantages of compact structure, convenience in operation and the like.

Description

technical field [0001] The invention belongs to the technical field of packaging equipment for electronic components, and more specifically relates to a dual-channel synchronous hot-pressing device for tape packaging of chip components. Background technique [0002] With the development of science and technology and the improvement of electronic technology level, as well as the miniaturization of electronic products, the further improvement of performance and reliability, electronic components have developed from large, heavy, and thick to small, light, and thin, and chip types have emerged. components and surface mount technology. Among them, in the production process of chip components, tape packaging is a common method, which is very suitable for the packaging of small and medium-sized chip components, so chip component tape equipment has become indispensable in the production of chip components device of. [0003] For now, there are mainly two types of tape packaging f...

AI Technical Summary

Problems solved by technology

However, further studies have shown that most of the above-mentioned existing equipment can only realize the heat-sealing process of material tapes of fixed specifications, and a few devices can adapt to the heat-sealing of material tapes of different widths, but it is difficult to ensure the pressure head during the entire heat-sealing process. Consistency of temperature and pressure; especially, when the pressure head is tilted to cause uneven pressure during the packaging process, the existing technology lacks an effective solution, which leads to inconsistent heat-sealing strength of the tape and poor heat-sealing effect , cannot protect the chip electronic components in the tape well

Images