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A thin slice laser module and laser system

A thin-sheet laser and thin-sheet technology, applied in the laser field, to reduce the heat conduction process, increase the heat dissipation rate, and increase the effect of heat dissipation

Active Publication Date: 2018-02-02
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a chip laser module, which aims to solve the thermal lens problem of the traditional chip laser, and then improve the output power, beam quality and stability of the chip laser

Method used

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  • A thin slice laser module and laser system
  • A thin slice laser module and laser system
  • A thin slice laser module and laser system

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Embodiment 1

[0036] see Figure 4 , 5 , The sheet laser module provided by the embodiment of the present invention includes: a pumping light source 1, a laser medium 2, a first cooling device 3 and a second cooling device 4 respectively arranged at both ends of the laser medium 2. Wherein, the laser medium 2 includes an undoped medium 21 and a thin gain medium 22 disposed at the bottom of the undoped medium 21 . The undoped medium 21 includes a frustum-shaped body 211, and two symmetrical planes (the first plane 212 and the second plane 213) are processed on the side of the body 211, and the pumping light and the Light-transmitting film with high transmittance for laser light. The sheet gain medium 22 is preferably bonded to the bottom of the body 211 using a chemical adhesiveless bonding technique. In addition, the bottom and top of the body 211 can be designed as circular stepped structures, ie, the top step 214 and the bottom step 215, so as to facilitate installation. further refer...

Embodiment 2

[0062] Figures 12 to 14 A schematic structural diagram of the thin-film laser module provided by the second embodiment of the present invention is shown.

[0063] Embodiment 1 provides a schematic structural diagram of a thin-chip laser module. For a laser system, it may include only one thin-chip laser module described above, or may include multiple thin-chip laser modules to realize power upgrade. This embodiment further provides a chip laser system formed by connecting multiple chip laser modules in series.

[0064] refer to Figure 12 , 13 , taking a sheet laser system including two sheet laser modules as an example. The sheet laser system includes a first sheet laser module 01 and a second sheet laser module 02, the two sheet laser modules are placed side by side on a flat base, and the basic composition and structure of the two sheet laser modules are the same. Wherein, the laser medium 012 of the first sheet laser module 01 and the laser medium 022 of the second sh...

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Abstract

The present invention is applicable to the field of laser technology, and provides a thin slice laser module, including a pump light source, a laser medium, and a first cooling device and a second cooling device respectively arranged at both ends of the laser medium; the laser medium includes an undoped medium and a set The thin sheet gain medium at the bottom of the undoped medium, the undoped medium includes a frustum-shaped body, the side of the body has symmetrical first and second planes, and the first and second planes are coated with a light-transmitting film; the first cooling device There is a first chamber, and the second cooling device has a second chamber, the first chamber is sealed by a thin sheet gain medium, and the second chamber is sealed by a non-doped medium; the pump light and laser are directed to the cooling liquid by the thin sheet gain medium total reflection occurs. In the present invention, the sheet gain medium and the non-doped medium are in direct contact with the cooling liquid, and the surface of the sheet gain medium has no coating, which improves the heat dissipation rate of the laser medium, eliminates the thermal lens effect of the sheet gain medium, and improves the stability and light beam of the laser. quality.

Description

technical field [0001] The invention belongs to the technical field of lasers, in particular to a thin slice laser module and a laser system. Background technique [0002] All-solid-state laser (DPSSL, Diode pumped solid state laser) refers to a solid-state laser that uses a semiconductor laser (LD) as a pumping source. The gain medium and pumping source are all composed of solid materials, so traditional solid-state lasers and semiconductor The advantages of a laser all in one. It has the advantages of small size, light weight, high efficiency, stable performance, good reliability, long life, easy operation, flexible operation (continuous operation, pulse operation), easy intelligence, and no pollution. It is the most potential laser at present. one of the sources. [0003] Flake lasers are a type of all-solid-state lasers. Such as figure 1 , the thin sheet gain medium 1 in the existing thin sheet laser generally adopts a thin sheet-shaped material with a small thicknes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S3/042H01S3/10
Inventor 赵建涛肖磊龚成万杨锦彬宁艳华高云峰
Owner HANS LASER TECH IND GRP CO LTD